Used ESEC 2007 BGA #136997 for sale

ESEC 2007 BGA (Ball Grid Array) Die Attacher is an automated pick-and-place machine used for attaching BGA components to printed circuit boards. The equipment is capable of placing chips on boards with any combination of pitch size and package size. 2007 BGA has a broad range of features which make it suitable for a variety of applications, from electronic assembly to full assembly of printed circuit boards. The machine is composed of an automated mounter, vision system, and control unit. The mounter is capable of placing and aligning packages with accuracy down to ± 0.03mm and can accommodate chips with a pitch size range of 0.4mm - 8.0mm. The mounter also has a removable rack for quick and easy loading of the placements matrix, which allows multiple and varied placements on a single board. The vision unit provides real-time feedback on placement accuracy and delivers high accuracy and repeatability. Its optical picker has an operating temperature range of 5 - 45 degrees Celsius, and a picking speed of up to 30 chips per second. Finally, ESEC 2007 BGA is controlled by the integrated control unit, which is built with a Windows-based software for fine tuning of settings and for customizing recipe requirements. In addition, on screen troubleshooting tools provide instant access to documentation and help simplify maintenance. 2007 BGA also comes with a variety of optional features, such as a tray feeder machine and a waste bin. The tray feeder tool allows the user to load multiple trays of chips simultaneously into the mounter, while the waste bin can be used to discard the packages after they are placed on the board. This asset also has an integrated bar code reader which can quickly identify components that need to be placed on the board. ESEC 2007 BGA is an efficient and robust die attacher that is suitable for a wide range of applications. It can easily accommodate a variety of components and is designed for high accuracy and repeatability in order to achieve a low defect rate. With its array of features and optional components, 2007 BGA is an ideal solution for any electronics assembly application.