Used NEWPORT MRSI 705 #9276185 for sale

NEWPORT MRSI 705 is a bonder used in the manufacturing of semiconductors and other IC chips. The MRSI is designed for automatically bonding small features and dimensions of CSP, BGA, SOIC and fine-pitch QFN packages, at high speed and with excellent accuracy and reliability. The bonder comes with a number of features, including a motion control equipment with an embedded PID control system, which ensures precise speed and position control during the process, ensuring maximum accuracy. NEWPORT 705 boasts an excellent thermal range of between 120°C and 260°C. This range is perfect for a number of bond techniques, such as heat reflow bonding, metal-clad bonding, and thermosonic bonding. This versatility of options ensures users are able to find the best bond for their specific application. As well as having an impressive thermal range, MRSI 705 also has a high bond force range between 5nN and 7.5nN for optimized performance on each substrate. These adjustable forces, also allow for thin and ultra-thin substrates to be universally used on the bonder. 705 also comes with a number of additional features, such as an in-plane vision unit for monitoring the bond and ensuring a reliable and consistent process, as well as a selectable bond area. This feature allows users to customize their process according to their particular substrate shape and size. As well as this, NEWPORT MRSI 705's integrated vision machine also has the capacity to detect any misalignment or misplacement so that the user can make corrections as necessary. The vision tool can also be used to monitor the bond area so that the bond is always as accurate as possible. NEWPORT 705 also features a high throughput of up to 5k hertz. Its powerful motion control allows the bonder to consistently achieve high speeds and excellent accuracy, making it ideal for high volume production. MRSI 705 offers a quiet and low-vibration environment, meaning the machine can be used in any laboratory environment. By using 705, users are able to simultaneously reach high yields, while not sacrificing speed or accuracy. Overall, NEWPORT MRSI 705 is an excellent bonder, ideal for use in the manufacturing of semiconductors and IC chips. It comes with a number of features, including a wide temperature range, adjustable bond forces, an in-plane vision asset, and a high throughput of up to 5k Hertz. Its user friendly interface and adjustable bond area make it a great choice for use in larger production environments. With its excellent accuracy and reliable results, NEWPORT 705 is an excellent choice for producing quality semiconductor and IC components.