Used TEL / TOKYO ELECTRON TELINDY B #9014197 for sale
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ID: 9014197
Wafer Size: 12"
Vertical diffusion furnaces, 12"
Base unit for DCS HTO process
Includes:
Cabinets / units / controllers included
Furnace cabinet (including ultra-clean air flow system)
Scavenger and water cooling unit
Power supply unit (U/P box)
(Includes control unit, transformers, SCR, and breaker unit)
Main controller (WAVES)
Temperature controller
FOUP and wafer handling automation included
FOUP load port
FOUP transfer
18 FOUP stocker
FIMS port
KHI wafer load automation
Variable pitch change mechanism (w/5 fork)
Auto tube shutter
Boat elevator w/ boat rotation mechanism
Mid temp heater: VMM-56-002 1 Included
Includes outer/inner T/C
Integrated gas system for DCS HTO 1 Included
N2O gas stick 1 stick Included
DSC gas stick 1 stick Included
Purge N2
Vacuum vent
Exhaust vent
Piping tape heater
PAC (Pre Activation Chamber)
Vacuum foreline configurations
Stainless steel manifold
80A foreline piping
Foreline heater
APC main valve
Vacuum gauge & pressure switch
US safety (S2-0302, S8-0999)
Quartzware set for DCS HTO 1 Included
(Including x2 of 75 slots Ladder Boat)
System options:
N2 Load lock option 1 Included
- O2 analyzer - NGK SH-302
- O2 consumption rate controller
Dual boat operation 1 Included
N2 boat cooling shower 1 Included
Fixture for start up and maintenance 1 Included
Final valve unit 1 Included
NH3 coating capability
Hi-temp capacity (<850°C)
2007 vintage.
TEL / TOKYO ELECTRON TELINDY B is a type of etcher, also known as an asher. It is a semiconductor and photovoltaic device fabrication equipment comprising a vacuum system, a process source unit, and a process unit. It uses electron beam technology and a dedicated software machine to control the etch process in both uniformity and accuracy. The etcher relies on three main components of its tool - the vacuum asset, the process source model, and the process unit. The vacuum equipment pumps out air and gas from the chamber and central to it is the turbomolecular pump. On the other hand, the process source system plays a key role in supplying the plasma source gas, which are accessed through an integrated network of mass flow controllers, pressure controllers, and multi-gas perforated tubes. Lastly, the process unit delivers the etch process within the chamber by controlling the applied gas pressures, flow rates, power and timing of the unit. TEL TELINDY B etcher can offer high accuracy and control within the etching process due to the electron-beam evaporator. This beam is used to control the evaporation of thin films sources in thickness control and it also has the ability to selectively coat plates. The etcher also allows for the arrangement of many process layers for etching through the use of a wafer CD (critical dimension) measurement machine. TOKYO ELECTRON TELINDY B etcher also has excellent temperature control capabilities, which can help regulate uniformity amongst different substrates. One of the added benefits of this etcher is that the operator has the ability to utilize process parameters such as chamber pressure, cooling gas pressure, and gas flow rate in order to tailor the etching process to their needs. Finally, the etcher is highly advanced as it is equipped with an intuitive software tool that allows the operator to optimize the etching process as well as automate many of the tasks. This makes it easier for the operator to adjust different process parameters and be sure that the outcome of the etching process is consistent and accurate. Overall, TELINDY B is a highly advanced etcher which features an electron beam evaporator to ensure accuracy and control over the etching process. Operators can utilize the process parameters to tailor the etching process to their needs, while the intuitive software asset ensures ease of use and automation of certain tasks.
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