Used ALCATEL / ADIXEN / PFEIFFER AMS 4200 #9304661 for sale
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ID: 9304661
Wafer Size: 6"
Vintage: 2007
Etcher, 6"
(2) Dry etch chambers
With (1) E-chuck
BROOKS AUTOMATION Handler
(4) Chambers
Load / Unload station
(4) Pumps
Control units
(2) Chillers
PWD Cabinet / Scrubber
(3) Computer consoles
(2) LN2 Tanks
Process chamber 1:
Silicon oxide (RGV Dielectric) etch process module
RIE Source reactor
Substrate holder with E-Chuck, 6"
Bias 600 W LF
Reactor pump: ADP 122H and ATH 1600M on DN40 Throttle valve
Gas lines: CF4, O2, CHF3, He
Process chamber 2:
Silicon etch process module
ICP Plasma source
Cryo temperature process
Cryogenic substrate holder
With mechanical clamping chuck, 6"
Source: 3 kW RF
Auto matching network
Laser view port adapter
Pumping line to pump down the substrate holder
He backside cooling
Bias 300 W RF
LN2 Controlled cooling
Dewar LN2 tank
PM ADP 122 Reactor pump
ATH 1600M Maglev turbo pump
DN200 Heated throttle
Cold trap
Gas lines: SF6, O2, O2, N2
Handling platform:
BROOKS AUTOMATION MX 600 Platform with MAG 7 robot
6-Sided platform:
(2) Process modules
(2) Cassette modules
(2) BROOKS AUTOMATION VCE6 Cassette modules
Electrical cabinet
RF Generator
PLC
Breaker
Control module
End point detection
Accessories
Etch module with gas cabinet: CF4, O2, CHF3, He, Ar, N2
Etch module with gas cabinet: SF6,O2, O2,N2
BROOKS MX 600 Handler platform
(2) Control cabinets
Power distribution cabinet
(2) ADP122H Fore pumps
(2) A100L Fore pumps
(2) Chillers
Transformer, 125 KVA
GUI, (3) Consoles
Gas abatement, centrotherm
Manuals
Cables
Hoses
Computer
Endpoint detectors
2007 vintage.
ALCATEL / ADIXEN / PFEIFFER AMS 4200 etcher/asher is a precision plasma etching and ashing equipment for a wide range of thin-film materials. It is used for producing high-quality geometric shapes, directional patterns, and structures with exacting accuracy. The system is ideal for sputtering, etching and cleaning processes. The unit boasts a highly compact profile and a wide array of innovative features tailored to meet the needs of today's etching and cleaning demands. Its advanced etching technology allow for precise, repeatable plasma etching and ashing processes that are capable of achieving very fine profile geometries. The machine features a very short processing time, while also offering superior process reliability due to its automated tool controls. The asset is specifically designed for the accuracy and repeatability that is required for sputtering, etching, and cleaning of thin-film materials. It has a full range of cleaning options ranging from isotropic etching to selective etching. Its advanced ion-beam deposition and pulsed processing systems allow for the production of very fine and consistent etch/ash patterns. Its open-chamber design provides an unrestricted view of the process while at the same time providing a constant environment that ensures a high level of uniformity throughout the etching/ashing process. The model also boasts a wide array of options for flexibility and customization. It has an adjustable flow nozzle, which allows for the maximization of the efficiency of particles being delivered to the substrate. The equipment also features a fully automated process controller, which ensures high repeatability and consistency during the etch/ash process. This process controller allows users to customize the plasma etching and ashing recipe for specific materials, ensuring the highest possible level of etching and ashing efficiency. ADIXEN AMS 4200 etcher/asher is an advanced and reliable etching and ashing system that is capable of providing a wide range of benefits to users. It provides greater accuracy and repeatability in etching and ashing processes, while also offering extremely short process times. Its open-chamber design and process controller allows for greater flexibility and customization, ensuring that users get optimal results for their etching and ashing processes.
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