Used ALLWIN21 AW 903e #9201808 for sale

Name: ALLWIN21 AW 903e
Brand: ALLWIN21
SKU: 9201808
Availability: InStock

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Rapid Thermal Processors

Manufacturer

ALLWIN21

Model

AW 903e

ID: 9201808

Wafer Size: 3"-6"

Plasma etcher, 3"-6" Wafer loading: 3-Axis robot Stationary cassette plate Plasma power: RF 13.56 MHz Type: Parallel / Single wafer process Stand alone Gas lines: 1-3 Lines Throughput: 30-60 WPH, Process dependent Temperature: 6-65ºC (±2 ºC) Capability Gas Lines: (4) Gas lines with MFCs Etcher rate: AW-901eR: 0-8000A / minute AW-903eR: 0-4000A / minute Process dependent Uniformity: Up to ±3%, Process dependent Particulate: <0.05 / cm2 Selectivity: 901eR: 2-20:1 AW-903eR: 2-20:1 Process dependent MTBF / MTTA / MTTR: 450 Hours / 100 Hours / 3.5 Hours Options: EOP Module with PCB GEM/SECS II Function Lamp tower alarm with buzzer Throttle valve pressure control Vacuum pump Chiller for chuck and chamber Through the wall Main frame, standard Pentium class PC with Keyboard Mouse USB SW Backup Cables Chuck:3"-6" Wafer aligner / Cooling station 3-Axis integrated solid robot: H-Zero (Standard) H1-7 x 10.5 (TTW) Fixed cassette station: Chuck assembly 901eR Non-anodized 903eR Anodized with flat 903eR Anodized with flat 903eR Non-anodized with flat Reactor Assembly: 901eR Non-anodized 903eR Anodized 903eR Non-anodized 903eR High performance Direct cooling Non direct cooling Pins: Quartz Ceramic SST Centering ring: Aluminum Ceramic Main control board: Gas box with (4) inline gas lines, MFC, filters, and pneumatic valves RF Matching network with PCB RF Generator: 13.56 MHz MKS Elite: 300 HD MKS Elite: 600 HD MKS Elite: 1000 HD ENI ACG 3 ENI ACG 10 AC / DC Box ATM Sensor UPC Pressure control 225 SCCM: 901eR 2000 SCCM: 903eR MKS Baratron with peumatic Iiolation valve Main vacuum valves Front EMO interlocks Touch screen GU, 15" AW-901eR AW-903eR Material Etched Polysilicon / Nitride Oxide,SOG,Nitride Main etchant gases SG6, O2 / SF6,O2 CHF3,SF6,He Other gases CHCLF2 / None None Pressure (mTorr) 200-450 / 250-350 1600-3000 RF Power (Watts) 100-250 / 200-300 400-600 Temperature (C) 30 / 30 23 AC Power: AC Module: 200-240 VAC Selectable, 50/60 Hz, 3-wire single-phase Temperature controller: 200-240 VAC, 50/60 Hz, 3-wire single-phase Vacuum pump: 208-230 / 460 VAC, 60 Hz or 200-220 / 380 VAC, 50Hz, 3 Phase RF Generator: 200-240 VAC PC / Monitor: 115 VAC Cabinet exhaust: 100 cfm.

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ALLWIN21 AW 903e Rapid Thermal Processor (RTP) is a highly advanced semiconductor device test and packaging equipment. It is capable of extremely high speeds and offers superior efficiency when compared to other thermal processing systems. AW 903e is a multi-stage thermal processing system that includes a furnace with an advanced temperature control unit, an LED die temperature management (DTM) module, and a pressure sensor for accurate discrimination of surface oxides. The RTP furnace is designed to generate a uniform temperature inside the processing chamber to ensure accurate results. It can be programmed to reach high temperatures quickly and can reduce cycle times by as much as 90%. The advanced temperature control machine allows the exact temperature of the furnace to be set via a touch panel feature. This advanced temperature control ensures consistent performance. The LED die temperature management module ensures that each die within the wafer is heated to the desired temperature. This ensures the uniformity of the results achieved. It also improves throughput by reducing the wait time between wafers. The pressure sensor is used to detect surface oxides which can affect the accuracy of results. By detecting these surface oxides, ALLWIN21 AW 903e can eliminate the formation of them. This ensures the accuracy of results is not affected. AW 903e has also been designed with flexibility in mind. It can incorporate additional modules such as Wafer Heating Tool and Wafer Mapping Asset for additional accuracy. It is fully automated and has been designed with safety and maintenance in mind, making it a very efficient device. ALLWIN21 AW 903e is a highly advanced RTP and has been designed to provide the highest level of accuracy and throughput when processing wafers. Its uniform temperature and advanced DTM ensures uniform performance, and its ability to integrate other modules for additional accuracy and efficiency make it ideal for many applications. It is efficient, safe to maintain and operate, and is easily integrated with existing systems.