Used ALLWIN21 AW 903e #9201821 for sale
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ID: 9201821
Wafer Size: 3"-6"
TTW Plasma etcher, 3"-6"
Wafer loading: 3-Axis robot
Stationary cassette plate
Plasma power: RF 13.56 MHz
Type: Parallel / Single wafer process
Through the wall (TTW)
Gas lines: 1-3 Lines
Throughput: 30-60 WPH, Process dependent
Temperature: 6-65ºC (±2 ºC) Capability
Gas lines: (4) Gas lines with MFCs
Etcher rate:
AW-901eR: 0-8000A / minute
AW-903eR: 0-4000A / minute
Process dependent
Uniformity: Up to ±3%, Process dependent
Particulate: <0.05 / cm2
Selectivity:
901eR: 2-20:1
AW-903eR: 2-20:1
Process dependent
MTBF / MTTA / MTTR: 450 Hours / 100 Hours / 3.5 Hours
Options:
EOP Module with PCB
GEM/SECS II Function
Lamp tower alarm with buzzer
Throttle valve pressure control
Vacuum pump
Chiller for chuck and chamber
Through the wall
Main frame, standard
Pentium class PC with
Keyboard
Mouse
USB
SW Backup
Cables
Chuck:3"-6"
Wafer aligner / Cooling station
3-Axis integrated solid robot:
H-Zero (Standard)
H1-7 x 10.5 (TTW)
Fixed cassette station:
Chuck assembly
901eR Non-anodized
903eR Anodized with flat
903eR Anodized with flat
903eR Non-anodized with flat
Reactor Assembly:
901eR Non-anodized
903eR Anodized
903eR Non-anodized
903eR High performance
Direct cooling
Non direct cooling
Pins:
Quartz
Ceramic SST
Centering ring:
Aluminum
Ceramic
Main control board:
Gas box with (4) inline gas lines, MFC, filters, and pneumatic valves
RF Matching network with PCB
RF Generator: 13.56 MHz
MKS Elite: 300 HD
MKS Elite: 600 HD
MKS Elite: 1000 HD
ENI ACG 3
ENI ACG 10
AC / DC Box
ATM Sensor
UPC Pressure control
225 SCCM: 901eR
2000 SCCM: 903eR
MKS Baratron with peumatic Iiolation valve
Main vacuum valves
Front EMO interlocks
Touch screen GU, 15"
AW-901eR AW-903eR
Material Etched Polysilicon / Nitride Oxide,SOG,Nitride
Main etchant gases SG6, O2 / SF6,O2 CHF3,SF6,He
Other gases CHCLF2 / None None
Pressure (mTorr) 200-450 / 250-350 1600-3000
RF Power (Watts) 100-250 / 200-300 400-600
Temperature (C) 30 / 30 23
AC Power:
AC Module: 200-240 VAC Selectable, 50/60 Hz, 3-wire single-phase
Temperature controller: 200-240 VAC, 50/60 Hz, 3-wire single-phase
Vacuum pump: 208-230 / 460 VAC, 60 Hz or 200-220 / 380 VAC, 50Hz, 3 Phase
RF Generator: 200-240 VAC
PC / Monitor: 115 VAC
Cabinet exhaust: 100 cfm.
ALLWIN21 AW 903e is a high-performance rapid thermal processor (RTP) designed for the semiconductor industry. It is ideal for temperature ramp-up/down processing of wafers and substrates, as well as for laser or ion implanters. AW 903e offers precise thermal control at temperatures up to 900°C and rapid ramp rates (100°C/sec to 800°C/sec). ALLWIN21 AW 903e utilizes a double-walled cooling equipment with a large thermal mass allowing precise temperature control of the substrate. It features a high-accuracy rate zone (HARZ) temperature control that allows precise thermal effects on the substrate based on the time spent in the HARZ. AW 903e is also equipped with a fully-automated process chamber cleaning system, designed to minimize downtime when cleaning the chamber between batches. The chamber can be cleaned with either H2O2, dry nitrogen, or any other suitable cleaning fluid; cleaning can also be performed manually. ALLWIN21 AW 903e is housed in a stainless steel cabinet, with an easy to use interface and a computer-controlled console to provide complete process control. The console allows for setting parameter values, customizing thermal profiles, and defining the process sequence. Additionally, AW 903e allows for remote operation, providing a convenient, secure, and reliable method for controlling the unit. For safety, ALLWIN21 AW 903e has several advanced safety features such as an inert gas purge, an emergency shut-off switch, a pressure valve for quick depressurization, and a temperature over-ride switch. Other features include a chamber with multiple optical windows to enable visual inspection of the process, and an automatic reset switch to reset the chamber pressure and temperature back to normal operating levels. AW 903e is an ideal rapid thermal processor (RTP) for semiconductor processing. It offers precise thermal control, rapid ramp rates, and a fully automated chamber cleaning machine, making it an ideal choice for wafer and substrate processing. The advanced safety features provide peace of mind while using the processor, and the console allows for easily customizable thermal profiles and process sequences.
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