Used AMAT / APPLIED MATERIALS Centura DPS II #9213084 for sale

AMAT / APPLIED MATERIALS Centura DPS II
ID: 9213084
Metal etchers Model Channel A, B: DPS II Channel C, D: AXIOM Chamber A, B: Model: DPSII metal Bias generator: AE Apex 1513 13.56 MHz, maximum 1500 W Bias match: AE 13.56 MHz,3 kV navigation Source generator: AE APEX 3013 13.56 MHz, max 3000 W Source match: AE 13.56 MHz, 6 kV navigation Lid: Ceramic lid, single gas nozzle Turbo pump: STP-A2503PV Throttle valve: VAT Pendulum valve DN-250 ESC: Dual zone ceramic ESC Endpoint type: Monochromatic Cathode chiller: SMC POU Wall chiller: SMC INR-496-016C Process kit coating: Anodize coating Cooling: HT 200 / FC 40 Chamber C, D: Model: ASP Source generator: DAIHEN ATB-30B Source match: DAIHEN SMA -3001 Throttle valve: Throttling gate valve ESC: Pedestal heater VODM Mainframe configuration: IPUP Type: ALCATEL A100L Gas panel type: NextGen VHP Robot: Dual blade MF PC Type: CL7 Factory interface configuration: Frontend PC type: 4.0 FEPC FIC PC Type: CPCI (3) Load ports Atmospheric robot: YASKAWA Track robot Side storage: Right side MFC Configuration: EWE-02A Gas name Max flow MFC type Gas 1 BCL3 200 SC-24 Gas 2 NF3 100 SC-23 Gas 3 - - - Gas 4 CL2 400 SC-24 Gas 5 C2H4/HE 400 - Gas 6 SF6 200 SC-24 Gas 7 O2 100 AANGD40W1 Gas 8 CF4 100 AAPGD40W1 Gas 9 AR 400 SC-23 Gas 10 N2 50 SC-22 Gas 11 N2 300 SC-24 Gas 12 CHF3 50 SC-23 EWE-02B Gas Name Max flow MFC type Gas 1 BCL3 200 SC-24 Gas 2 NF3 100 SC-23 Gas 3 - - - Gas 4 CL2 400 SC-24 Gas 5 C2H4/HE 400 - Gas 6 SF6 200 SC-24 Gas 7 O2 1000 SC-25 Gas 8 CF4 100 SC-23 Gas 9 AR 400 SC-23 Gas 10 N2 50 SC-22 Gas 11 N2 300 SC-24 Gas 12 CHF3 50 SC-23 EWE-02C Gas Name Max flow MFC type Gas 7 O2 10000 SC-27 Gas 8 CF4 300 SC-24 Gas 9 - - - Gas 10 N2 1000 SC-25 EWE-02D Gas Name Max flow MFC type Gas 1 - - - Gas 2 - - - Gas 3 - - - Gas 4 - - - Gas 5 - - - Gas 6 - - - Gas 7 O2 10000 SC-27 Gas 8 CF4 300 SC-24 Gas 9 - - - Gas 10 N2 1000 SC-25.
AMAT / APPLIED MATERIALS Centura DPS II is a modular wafer processing equipment used for a variety of applications in the semiconductor and optical industries. It consists of two main components, a platen and a reactor chamber. The platen is the interface between the processing tools and wafers which must be introduced and removed from the system. It facilitates the alignment and placement of substrates into the reactor chamber to ensure accurate processing. It also includes features such as a wafer handler, optical post-alignment and bath components to further improve the overall process. The reactor chamber is the main processing area of the unit and is designed to accommodate a variety of reaction conditions. It consists of a processing chamber, platen transfer arm, reaction chamber lid, entry/exit valve, exhaust port and optional features such as a remote plasma source, an Auto-GC and an RF generator. The reaction chamber lid provides a controlled environment for processing within the chamber, allowing for accurate control of temperature and pressure. The entry/exit valve serves as the interface between the platen and the reaction chamber. It opens and closes allowing substrates to enter and exit the chamber. The exhaust port allows the evacuation of any reactive gases during processing. AMAT Centura DPS II provides a range of benefits such as improved design flexibility with its modular approach, increased process control from the reaction chamber lid and improved wafer handling and alignment from the platen. It also enables repeatable processes, faster cycle times and higher throughputs. The machine is specifically designed to maintain a clean operating environment, making it suitable for dry plasma etching processes. Overall, APPLIED MATERIALS CENTURA DPS+ II is a reliable and user-friendly reactor tool which can be configured to accommodate a range of applications. Its modular design allows users to easily adapt the setup for specific needs providing flexibility and control. The asset can increase throughput, improve product yields, and reduce time and cost of manufacturing.
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