Used AMAT / APPLIED MATERIALS P5000 #197620 for sale

It looks like this item has already been sold. Check similar products below or contact us and our experienced team will find it for you.

AMAT / APPLIED MATERIALS P5000
Sold
ID: 197620
Wafer Size: 5
Vintage: 1990
Poly etcher, 5" Processing type: Vacuum Wafer type: Flat-zone (2) Chambers MFC: Chamber A: GAS #7: O2 20 sccm GAS #8: SF6 300 sccm GAS #9: Cl2 200 sccm GAS #10: Ar 200 sccm GAS #11: CHF3 200 sccm GAS #12: O2 3000 sccm Chamber B: GAS #1: O2 20 sccm GAS #2: O2 300 sccm GAS #3: Cl2 200 sccm GAS #5: SF6 200 sccm GAS #6: CF4 100 sccm GAUGE: (2) MKS 390HA Baratrons, 1 torr (1) MKS 122AA Baratron, 10 torr System: TMP: SEIKO SEIKI STP-H200C TMP Controller: SEIKO SEIKI STP-H201C Robot Robot controller Sub module: AC Rack RF Gen (A): ENI OEM-6AM-1B RF Gen (B): ENI OEM-6B-02 RF Match (A): AMAT 0010-09416 RF Match (A): AMAT 0010-09416 Includes: Main body Remote AC rack Trans Heat exchanger (2) NESLAB Chiller Monitor rack (2) Side skin Monitor Endpoint monitor Endpoint (6) Part boxes Currently stored in cleanroom 1990 vintage.
AMAT / APPLIED MATERIALS P5000 is a state-of-the-art chemical vapor deposition (CVD) reactor designed to create thin films with high throughput and high uniformity. This reactor features a rotary reactant introduction equipment, a wafer chuck subsystem, and an apertureless low-loss exhaust system. The unit is built with a modular, user-friendly platform that allows the user to customize their machine to their applications. AMAT P-5000's rotary reactant introduction tool provides an even distribution of reactants over the substrate, improving uniformity. This feature also allows for precise control of the gas distribution and flow rate. This results in improved coverage of the bottom of the wafer as well as quick response time. This can help decrease deposition time and improve wafer uniformity. The wafer chuck subsystem is a temperature-controlled mechanical asset that allows for precise temperature sensing of the substrate during the deposition process to ensure uniformity. The temperature control of the chuck is customizable based on individual process requirements and the chuck has a temperature range of -50°C to +400°C. APPLIED MATERIALS P 5000 also features an apertureless low-loss exhaust model. This equipment maximizes the deposition pressure and prevents the formation of particulates that can reduce process yields. The exhaust system is also designed to provide outstanding unit performance with low maintenance requirements. AMAT P5000 is a flexible and user-friendly machine. Its modular platform allows for easy customization for individual applications that require precise control of gas distribution and flow rate. The tool also provides superior uniformity and fast response time, improving wafer throughput and decreasing deposition time. With its temperature-controlled wafer chuck and a low-loss exhaust asset, APPLIED MATERIALS P-5000 provides an advanced CVD solution that optimizes wafer processing.
There are no reviews yet