Used AMAT / APPLIED MATERIALS P5000 #197620 for sale
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ID: 197620
Wafer Size: 5
Vintage: 1990
Poly etcher, 5"
Processing type: Vacuum
Wafer type: Flat-zone
(2) Chambers
MFC:
Chamber A:
GAS #7: O2 20 sccm
GAS #8: SF6 300 sccm
GAS #9: Cl2 200 sccm
GAS #10: Ar 200 sccm
GAS #11: CHF3 200 sccm
GAS #12: O2 3000 sccm
Chamber B:
GAS #1: O2 20 sccm
GAS #2: O2 300 sccm
GAS #3: Cl2 200 sccm
GAS #5: SF6 200 sccm
GAS #6: CF4 100 sccm
GAUGE:
(2) MKS 390HA Baratrons, 1 torr
(1) MKS 122AA Baratron, 10 torr
System:
TMP: SEIKO SEIKI STP-H200C
TMP Controller: SEIKO SEIKI STP-H201C
Robot
Robot controller
Sub module:
AC Rack
RF Gen (A): ENI OEM-6AM-1B
RF Gen (B): ENI OEM-6B-02
RF Match (A): AMAT 0010-09416
RF Match (A): AMAT 0010-09416
Includes:
Main body
Remote AC rack
Trans
Heat exchanger
(2) NESLAB Chiller
Monitor rack
(2) Side skin
Monitor
Endpoint monitor
Endpoint
(6) Part boxes
Currently stored in cleanroom
1990 vintage.
AMAT / APPLIED MATERIALS P5000 is a state-of-the-art chemical vapor deposition (CVD) reactor designed to create thin films with high throughput and high uniformity. This reactor features a rotary reactant introduction equipment, a wafer chuck subsystem, and an apertureless low-loss exhaust system. The unit is built with a modular, user-friendly platform that allows the user to customize their machine to their applications. AMAT P-5000's rotary reactant introduction tool provides an even distribution of reactants over the substrate, improving uniformity. This feature also allows for precise control of the gas distribution and flow rate. This results in improved coverage of the bottom of the wafer as well as quick response time. This can help decrease deposition time and improve wafer uniformity. The wafer chuck subsystem is a temperature-controlled mechanical asset that allows for precise temperature sensing of the substrate during the deposition process to ensure uniformity. The temperature control of the chuck is customizable based on individual process requirements and the chuck has a temperature range of -50°C to +400°C. APPLIED MATERIALS P 5000 also features an apertureless low-loss exhaust model. This equipment maximizes the deposition pressure and prevents the formation of particulates that can reduce process yields. The exhaust system is also designed to provide outstanding unit performance with low maintenance requirements. AMAT P5000 is a flexible and user-friendly machine. Its modular platform allows for easy customization for individual applications that require precise control of gas distribution and flow rate. The tool also provides superior uniformity and fast response time, improving wafer throughput and decreasing deposition time. With its temperature-controlled wafer chuck and a low-loss exhaust asset, APPLIED MATERIALS P-5000 provides an advanced CVD solution that optimizes wafer processing.
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