Used OXFORD Plasmalab 800 Plus #9068315 for sale
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ID: 9068315
DP PECVD System
PC Control
"Master/ Slave" Concept: RIE/PECVD
Master 800 Plus with Slave 80 Plus possible
Clean room compatible
Tool, used for Batch Process
Contains 18" heated Platen
RF Components:
ENI ACG-5XL RF generator, 13.56MHZ, 500W
ENI LPG-6A , RF generator, 90kHz to 460kHz, 600W
ATX-600 impedence matching network.
Gases Previously Used: N2O , N2, NH3 and SiH4
TEOS retrofit kit: included
Roughing pump: available
Reactive Ion Etching (RIE):
13.56 MHz driven parallel plate reactor
Cooled electrode
Shower head gas inlet optimised for RIE
High conductance vacuum layout
Etch modes: RIE/ PE
Plasma Enhanced Chemical Vapor Deposition (PECVD):
13.56 MHz driven parallel plate reactor
Shower head gas inlet optimised for PECVD
Heated substrate table
OXFORD Plasmalab 800 Plus is an advanced etching and ashing equipment used to etch and remove material from a variety of substrates. This system uses a plasma process to etch and asher to deliver superior results in a wide range of applications. The unit's main components include a vacuum chamber, plasma source, and an advanced control machine. The vacuum chamber is used to contain the plasma process, allowing the tool to reach high etching speeds without the need for extreme temperatures. The chamber is equipped with an RF-heated, boron nitride susceptor and an inline temperature controller, allowing for precise temperature control and sophisticated control of the plasma power per unit area. The plasma source consists of a gas panel, power supply, and leak detector. The gas panel consists of an RF generator, vacuum regulator, mass flow controllers, isolation valves, and numerous other components. This provides the user with seamless control over the type of gas used, total pressure, flowrate, and microwave frequency. In the power supply, both HF and RF power are directed through matched cables and into the vacuum chamber. From there, it is applied to the plasma source through the gas panel. This asset offers the user variable power control spanning a full range of 50 W to 1000 W. Plasmalab 800 Plus also features an advanced control model. This consists of an advanced visual touchscreen and PC based control unit. The graphical user interface allows the user to easily monitor process parameters and manually adjust various settings. From material etching to surface clean and passivation, OXFORD Plasmalab 800 Plus is the perfect choice for a variety of advanced etching and ashing processes. With its highly optimized, efficient design, it offers superior performance and results for industrial and laboratory applications.
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