Used PLASMATHERM SLR 772 #9195260 for sale
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ID: 9195260
Wafer Size: 4"
Etcher, 4"
Adapter plates for 2"
ALCATEL 5900 Turbo pump
700W ASTEX Microwave power supply: 2.45 GHz
RF 5S 555W RF supply: 13.56 MHz
Ultra low cooling option: Down to -150°C with LN2
Loadlock (Semi manually controlled with switches)
TEKTEMP TKD-100 Heat exchanger
ASTEX 1000W Microwave supply
Spare ECR head
Aluminum showerhead assembly
Cooling ring for etch option
Deos not include load lock pump
Main console electronics
Process / Sequence controller
Core interface
252C-1-5 Exhaust valve controller
AM-5 700 RF Matching network
Fixed capacitance loading: 600 pF
DC Probe range: 1000 V
AMNPS-2A 700 Matching network power supply
290-03 Ion gauge controller
286 Thermocouple gauge controller
Heater control box
RF-5S RF Generator
Output power: 555 Watts, 13.56 MHz
HS-700 Microwave generator
Output power: 700 Watts, 2.45 GHz
Gas panel:
Chamber 1:
CH1 N2 FSF 20 SCCM
CH2 N2 FSF 50 SCCM
Chamber 2:
CH1 C12 FSF 20 SCCM
CH2 N2 FSF 20 SCCM
Fluid input panel:
Air regulator setting: 80 Psi
Pressure switch: 70 Psi
Input requirements:
Compressed air: 80 Psi
Nitrogen: 20 Psi
Water: 20 Psi
System power center:
Line voltage: 208 VAC
Maximum current: 60 Amps, 4-wire
Motor starter overload current setting
Mechanical pump: 6 Amps
Vacuum pumps:
023-241 Lock mechanical pump
Fluid type: Fomblin 14-6
Charge: 6 Kg
TDK 100 Temperature control system
Fluid type: 50/50 Glycol
Local setpoints CH1: 25°C
Aluminum chamber lid with 10" shower head
Power: 208 V, 60 Hz, 100 Amp
Manuals included.
PLASMATHERM SLR 772 is a state-of-the-art etcher/asher that provides high precision process capabilities for applications including semiconductor etching, materials research and thin film deposition. With its advanced design, SLR 772 offers high precision, repeatability, and uniformity for etching and ashing processes. The equipment utilizes a spiral showerhead design that provides uniform, stable, and easy access to the etching chamber and wafer conveyor. The showerhead delivers precisely uniform process parameters to the wafer, thus ensuring precise and uniform etching and ashing. PLASMATHERM SLR 772 can process wafers up to 5 inches in diameter, and can provide a maximum pressure of 3 mTorr along with an automated pressure control feature that allows rapid set-up and run times. A built-in, integrated vacuum gauge provides process and calibration verification, and can be used for monitoring wafer temperature in real-time. The advanced software that comes with SLR 772 allows for complex process optimization through parameter customization. Automated wafer handling via cassette loading and unloading ensures minimal system downtime. An adjustable etching/processing chamber allows a variety of wafer sizes to be processed quickly and accurately. In addition, the etching process can be monitored through the integrated computer vision unit, which provides detailed process analysis. PLASMATHERM SLR 772 provides a variety of etching and processing applications including shallow trench isolation (STI) etching, gate etching, contact hole etching, buried gate etching, and polysilicon etching. The machine offers very high process rates, with process times as low as 5 seconds. The etching process can be combined with other process operations such as plasma deposition, which enables device fabrication with high throughput. SLR 772 is an excellent choice for a variety of application requirements providing consistent, repeatable results with high process efficiency and repeatability. With its advanced features and flexibility, PLASMATHERM SLR 772 is an excellent choice for etching and ashing applications.
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