Used TEL / TOKYO ELECTRON Telius SP-2055 VV #122877 for sale

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TEL / TOKYO ELECTRON Telius SP-2055 VV
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ID: 122877
Wafer Size: 8"
Vintage: 2003
Oxide etcher, 8" (2) Telius SP Vesta Chambers 2003 vintage.
TEL / TOKYO ELECTRON Telius SP-2055 VV is an etcher/asher that is designed for applications that require high accuracy and high throughput for etching and ashing of the highest quality results. This is the ideal equipment for a wide range of samples from materials such as SiO2 and SiN, to anisotropic etching of metal, insulating and semiconductor materials. Etching/Ashing of resists on metal/silicon substrates can also be done in accordance with the application. TEL Telius SP-2055 VV features a gas flow system with a multi-stage pumping unit and a gas box that can be adjusted to increase processing speed. A vacuum control with sustained accuracy allows for a drive speed up to 13.9L/min with a maximum of 4.41 mbar in the chamber. It also has an automatic pressure control (APC) machine that allows for the adjusting of the pressure level as necessary. The tool also has a self-cleaning turbomolecular pump with a regeneration cycle time of 1-9 minutes. TOKYO ELECTRON Telius SP-2055 VV also has an advanced wafer temperature control asset with a working range between -40°C and its wafer temperature limit at 100°C. Its improved cooling model allows the operator to adjust the cooling rate of the chamber walls to extend etching process time where needed. Telius SP-2055 VV also features a precision etcher/asher with a load lock equipment that allows for the positioning of the wafer on the sample holder without opening the turret door. This is done in order to prevent contamination of the sample when changing wafers. Its wide-range software provides an easy-to-use user interface for setting up and monitoring of parameters. The set-up time and sample loading time are also reduced with the restorative auto cleaning system. TEL / TOKYO ELECTRON Telius SP-2055 VV is designed specifically for high accuracy and high throughput of the highest quality results. It features a gas flow unit with a multi-stage pump and adjustable performance and a vacuum control machine with settled accuracy. It also has an improved wafer temperature control tool and cooling asset to extend etching time. The precision etcher/asher also has a load-lock model and an auto-cleaning equipment as well as a wide range of software for automatic setting up and monitoring.
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