Used TEL / TOKYO ELECTRON Telius SP 305 SCCM #9074890 for sale

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TEL / TOKYO ELECTRON Telius SP 305 SCCM
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ID: 9074890
Dielectric etcher, 12" Standard Specifications Software Revision: Linux 5.75 Rev 001 Lot Stability Dummy SW: Software for running lot stability wafer OEE WPH Software: Yes GEM SEC Revision: TBD Wafer Size: Diameter 300+/- 0.20mm(SEMI M1.15), Notch Carrier: FOUP (Comply with SEMI E47.1 (25wafers)) Inter Face: 5 carrier stage (Continuous flow operation) with Semi compliant MENV and FIMS assemblies Online Connection: GEM / CIM GJG (Hardware Interface : Ethernet 100Base-Tx) Interface A: Yes Utility Box: Regulator: Air/AR2500(SMC), N2/SQ-420E(VERIFLO), He/SQMICRO(VERIFLO) Utility Box: Manual Valv: OGD20V-6RM-K / OGD10V-4RM-K (CKD) Utility Box: Pressure Gauge: Bourdon Gauge Loader Mod Corrosion Prevent: NO, without Corrosion Prevent Load Lock Pressure Monitor: Pressure Switch: VSA100A (INFICON) Load Lock Pressure Monitor: Pirani gauge: TTR211S LEYBOLD) Load Lock Pressure Monitor: CM: 626A01TDE (MKS) Maintenance Monitor: 2 (Flat Panel Display Touch Screen Type) Water Leak Detector: 5 (LM;1, each PS;1) Signal Tower: Red/Yellow/Green/Blue (Upper Left of Front x1 & Upper right section of loader on maintenance side x1) Data Back up: USB& MO EMO: Front x3, Rear x6 Cable Length: One 15m and one 16m (Interconnection, RF cables) Inter Locks: External (When the I/L signal is received from Factory, gas valves are closed) Fittings: No brass fittings Supporting Remote Units Chiller: UBRPD5A-2T  Coolant: Lower:FC3283, Upper:FC40 Chiller Hose: BRINE HOSE 15/14M Handy Maintenance Controller: LCD DISPLAY UT3-TLN21-A RF Generator TOP: AGA-50B2 RF Matcher TOP: AMN-50B2 RF Generator Bottom: WGA-50E Matching Controller: WMN-50H6(2MHZ/5KW)(PS3) Pen Record Box: 2L80-00212-12 Loader Module: SELME2112ZS22-AD5 LOAD PORT: NO, Bolts-L type DRIVE UNIT: SBX92102928 READER OPTICAL: ISS-1700-1TELCC Carrier ID Reader: NO,V640series+V700-L22 (Omron) APC: 12" (320MM) Hardware Configuration Proc Chbr 1,2,3,4: SCCM Oxide; Y203 Coating Chamber hardware: FCC Endpoint type: SE2000ii ESC type: Ceramics ESCwith STD Vpp Focus ring: 3.4mm Thunderwall He Gas Inlet: Ceramic Thunderwall with Ceramic pusher pins Polished focus ring: O FC lower insulator: FC lower insulator w/quartz upper ring shield Magnet Shield: O Oring for Chbr Body-Depos: Armorcrystal, Chemraz SC657 CEL Body ASSY: Brine Control Mode TMP: TMP-3403LMC-T4(VG300) (SHIMADZU) TMP Back Pressure Monitor: 51A11TGA2BA003 (MKS) Dry Pump: ESR80WN, KEG approved Final Valve, Heater: Valve; AGD21V-6RM-GWL4 (CKD) Filter: Filter; CEP-TM_HL-VR-03PB (Toshiba Ceramic) APC: Pendulum Motion Dia., 320mm(VAT), R.T.~90deg Pressure Monitor: C/M (Process Monitor) : 627BRETDD2P (MKS), 45deg, 30Pa Pressure Monitor: C/M (Self Check) : 627B11TDC2P (MKS), 45deg, 1330Pa Pressure Monitor: B.A. Gauge (CM Calibration) : BPG400 (INFICON), 2.0x10-5 ~ 0.1Pa Pressure Monitor: N,41A13DGA2AA040 (MKS), no process impact Pressure Monitor: Pressure Switch : 51A11TGA2BA010 (MKS), H2/fluoro gas Gas Box Configuration: Gas line 1- N2 1000 sccm-AERA FCD985CT-BF Gas line 2- C4F8 200 sccm-AERA FC-D985CT-BF Gas line 3- Ar 2000 sccm-AERA FC-D985CT-BF Gas line 4- O2 50 sccm-AERA FC-D985CT-BF Gas line 5- CH2F2 30 sccm-AERA FC-D985CT-BF Gas line 6- CHF3 200 sccm-AERA FC-D985CT-BF Gas line 7- CF4 200 sccm-AERA FC-D985CT-BF Gas line 8- C4F8 50 sccms-AERA FC-D985CT-BF Gas line 9- C3F8 50 sccms-AERA FC-D985CT-BF Gas line 10- C4F6 50 sccm-AERA FC-D985CT-BF Gas line 11- O2 1000 sccm-AERA FC-D985CT-BF Gas line 12- Ar 500 sccm-AERA FC-D985CT-BF Purge: N2 (Process Grade N2) Filter: CNF1004USG4 (Nihon Pall) Regulator: SQMICRO (VERIFLO) Filter (N2): CNF1004USG4 (Nihon Pall) Valve: Primary side(Utility-MFC):Mega mini (FUJIKIN) Valve: Secondary side(MFC-PC):Mega one (FUJIKIN) Piping: Dual Piping (for Gas leak containment, Gas box to Final valve & Exhaust through Gas box) Gas Leak Detection Port: 5 Ports (6.35mm, Swagelok L-type) Final Pressure Switch: 51A (MKS) Pressure Gauge: Bourdon Gauge (with inside finishing) Pressure Gauge: Bourdon Gauge (with inside finishing) 0.4MPa SP3 Gas Line Connection: No GBROR: GBROR Process Kit Configuration: WINDOW, SHIELD DEPO (DRM2) QUARTZ (ES1D05-400022-14) WINDOW DEPO SAF0.5(DRM2) SAPPHIRE (ES1D10-406499-11) SHIELD, UPPER 300MM RING – Quartz (ES3D05-250025-11) Insulator, ESC Enclosure (COC) – Quartz (ES3D05-300142-13) Cover Ring, 360- L (M) – Quartz (ES3D05-300243-11) RING, BTM SHIELD Y-AL, SE (ES3D10-100844-11) PLATE,EXHAUST Y-AL, SE (ES3D10-100845-11) SHUTTER, BTM TYPE Y-AL, SE (ES3D10-101152-13) SHIELD,DEPO (ES3D10-101195-11) Focus Rg, 360-302-COC (ES3D10-201448-13) Insulator, lower T32-BI-NC (ES3D10-202405-13) WINDOW,DEPO CLP/Y2O3-100P(N) (ES3D10-350344-12) SCREW PIN LOCK, Cerazol: Ceramic (ES3D10-404011-11) Si Upper Electrode (ES3D10-253020-11) CEL ASSY (ES3D87-052656-11) ESC ASSY (with ceramic pusher pins) (ES3D87-002056-13) Damage/Missing Parts: Non reported, please reconfirm at tool inspection Currently installed.
TEL / TOKYO ELECTRON Telius SP 305 SCCM is a surface mount coating and etching machine that is used in the creation of intricate printed circuit boards (PCBs). The device features a conveyor belt for the transport of PCBs and components, as well as an electronic vision system for accurate positioning. The machine is capable of applying both dry film photoresist and liquid resists in high resolution, and with multiple layers, allowing for fine-detail surface wiring. It can also be used for post-processing of components such as through-hole connectors, solder mask, etc. TEL Telius SP 305 SCCM features a high-speed wafer processing speed of up to 400 mm/s, with in-process control for uniform blind and/or buried via performance. It also includes a multi-zone controller for precise etching control, enabling high-precision etching and milling of complex shapes. The device also includes a range of special functions such as vision alignment, hole identification, and removal of shorts. TOKYO ELECTRON Telius SP 305 SCCM is equipped with the TELBEANS real time PC based system, allowing for easy user interface control. It also includes a universal stencil system for easy loading and unloading of etched circuit boards. The device is also compatible with a variety of photo resist materials, including positive and negative tone photoresists and liquid resists. The machine is designed for continuous operation, and boasts a heated substrate loading area with a optimized hot edge design for high throughput. Its laser-markable cover sheet protects the circuit board during etching, saving time and materials. With its intuitive and easy to use interface and host of features, Telius SP 305 SCCM serves as a great device for manufacturing of high-quality circuit boards and components.
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