Used NIDEC TOSOK DBD3570 SDW Series for sale

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NIDEC TOSOK DBD3570 SDW Series #100164
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NIDEC TOSOK

DBD3570 SDW Series

Die bonder, 8" Bonding Method: Solder Chip Size: 1.0mm - 6.0mm Bonding Accuracy: XY = ±50 um, Θ±3° (
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