Used LEICA / VISTEC INS 3000 DUV #9000424 for sale

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LEICA / VISTEC INS 3000 DUV
Sold
ID: 9000424
Wafer Size: 4"-8"
Vintage: 2003
Defect inspection system, 4"-8" Power console with emergency off switch Signal tower Intermediate tube with camera port Microscope: 5x, 20x, 50x, 100x, 150x(1), 150x(2) Operator console with trackball and joystick (ASCII keyboard underneath) Observation tube with eyepieces X-Y stage Motorized beamsplitter LCD monitor Cassette port with tilting mechanism Control electronics Transport wheels Contamination protection Prealignment: Contact-free, ± 0.25° rotational < ± 50 micron in x and y Macro defect control: Optional wobbler with illumination device User interface: Windows NT based inspection Interface: RS 232-SECS 1/2, Ethernet interface DUV Function: Not setup Does not include: Macro defect control, wobbler with illumination device 2003 vintage.
LEICA / VISTEC INS 3000 DUV is a mask and wafer inspection equipment. It has an imaging area of 13.44 x 13.44 microns that is scanned with a 9 nm deep-UV (DUV) laser. The system is capable of detecting defects as small as one-tenth the laser wavelength and provides a maximum detection throughput of up to 2 wafers per hour. The unit can also inspect high resolution patterns in multiple layers up to 6-by-6nm features. The inspection machine is designed for defect review, editing, defect grading, and critical process detection for semiconductor mask layers. The tool includes a software suite to facilitate image acquisition, image processing, and defect detection. The software provides user controllable parameters for automated defect identification and defect editing, as well as support for automated mask inspections, and wafer inspections with automatic recipe generation. The asset boasts a field of view of up to 350165nm and can use its high resolution navigation model to provide a field of view of 2x the area of the laser field. It is equipped with advanced imaging software to provide timing and synchronization for acquisition, editing, grading, and defect overview. The equipment also uses variable laser power to speed up operations and reduce false positives. The system has a robust feature set to ensure that it can meet a wide variety of inspection requirements. Its high performance optics allow for accurate defect detection and feature characterization up to the nanometer level. It is equipped with a robust unit of adjustable parameters for automated and manual defect review and feature recognition. The machine also includes advanced image processing algorithms to filter, enhance, and adjust contrast and brightness. Its multiple layers scanning capability is ideal for multi-level inspection. Finally, LEICA INS 3000 DUV is designed with a stable, low-maintenance, and cost-effective architecture for reliable operation. Its multiple graphical user interface options and its fail-safe tool design provide convenience and robustness for users. All these features and its advanced mask and wafer inspection asset make VISTEC INS 3000 DUV an excellent choice for mask and wafer inspection.
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