Used LEICA / VISTEC INS 3300 #9195365 for sale

LEICA / VISTEC INS 3300 is a versatile mask and wafer inspection equipment. The system offers metrology-grade capabilities for optical inspection of color and high-resolution images, as well as dimensional and high-precision measurements for all stages of the semiconductor process. The flexible design of LEICA INS 3300 meets the changing needs of the highly automated production environment. VISTEC INS 3300 offers high-accuracy, non-contact optical inspection of wafers and masks of all sizes. The unit utilizes automated focusing, stitching, optical defect inspection, fiducial alignment, and fiducial measurement to assure the accuracy of masks and wafers. The machine can automatically detect optical and mask defects, allowing users to quickly identify and rectify production process errors, and to avoid time-consuming reticle remakes. The tool provides precise measurements to confirm the accuracy of mask shapes. The highly sensitive imaging sensors offer sub-micron resolution in the X- and Y-axis, while a 14-bit A/D converter ensures accuracy in the Z-axis. Furthermore, 2D and 3D surface analysis algorithms provide contour mapping of mask features to ensure critical dimensional accuracy and defect detection. In addition, INS 3300 enables engineers to inspect multiple masks simultaneously, reducing the need for multiple re-measurement. The multi-mask inspection feature supports concurrent inspection of masks from multiple sources, enabling faster turnaround times and greater reliability in production. In summation, LEICA / VISTEC INS 3300 offers an extensive suite of powerful, versatile features and capabilities for manufacturers of semiconductor components. Its metrology-grade accuracy, precise automated measurement capabilities, and concurrent multi-mask inspection capabilities makes it an ideal asset for organizations looking for improved product quality and reliability. Moreover, its flexible design fits the needs of the changing high-volume semiconductor industry with its automated focusing, stitching, optical defect inspection, fiducial alignment, and fiducial measurement capabilities.