Used LEICA / VISTEC MIS 200 #9254135 for sale

LEICA / VISTEC MIS 200 is a leading automated mask & wafer inspection system. Developed by LEICA, it offers fast and reliable defect detection and classification capabilities with its advanced imaging, machine learning and pattern recognition techniques. It maximizes quality control and accelerates mask and wafer manufacturing processes. LEICA MIS 200 is able to acquire images of each layer of the mask or wafer with its dynamic lighting, brightfield, darkfield, and oblique-angle optical modes. It can detect and classify defects down to the nanometer scale due to its superior imaging power and a variety of in-line inspection techniques. The system can construct 3D images of each layer on masks and wafer surfaces for more accurate detection. VISTEC MIS 200 features an intuitive Graphical User Interface (GUI) that enables operators to perform faster and more knowledgeable decisions regarding quality control. The GUI is equipped with touch-based operations that provide navigation and navigation control, allowing for easier experimentation in complex defect analysis. It also has an integrated image analysis, image correction, and defect map analysis software that expedite and accelerate quality control operations. For metrology and defect tracking, MIS 200 is integrated with pattern recognition algorithms and robust defect detection technologies. Advanced algorithms accurately detect and classify defects on each layer of the mask or wafer and create a comprehensive defect profile with sensing and measurement capabilities. This helps operators to perform further analysis and make well-informed decisions. Furthermore, LEICA / VISTEC MIS 200 provides statistical process control (SPC) capabilities to monitor the manufacturing process and measure the quality of the products. This helps to reduce mask and wafer manufactured rejects and wastage. In conclusion, LEICA MIS 200 is a high-performance mask and wafer inspection system. It features reliable defect detection, image and defect analysis, and statistical process control capabilities. Its advanced imaging, pattern recognition, and machine learning technologies enable operators to quickly identify and address defects, improve quality control, and reduce rejects and wastage.