Used SCHMITT INDUSTRIES TMS-3000WRC #9225643 for sale

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ID: 9225643
Wafer Size: 5"-12"
Vintage: 2014
Surface roughness system, 5"-12" Non-contact measurement Full surface scan Front and backside measurement Friendly GUI Mapping (Color plot) function Measurement material: Bare silicon wafer / Coated silicon wafer Measurement size: 4"-12" Measurement thickness: < 100 um Water chuck method: Vacuum chucking Rotary stage: Repeatability: +/- 0.01° Accuracy: +/- 0.05° Linear stage: Repeatability: +/- 0.01 mm Accuracy: +/- 0.03 mm Computer: Pentium class computer Data generation: ASCII / SPC / Color plot with scan notes Measurement specification: Source: Class II Laser, 670 nm Spot size: ~1mm Diameter Measurement points: Programmable (Single point to full map) Data type: Ra, RMS(Rq), PV, TIS, Haze Edge exclusion: 1mm Measurement speed: 20 to 100 Measurement points / sec Measurement range: 0.2A to 10,0000A (RA or RMS) Resolution: 0.02A Repeatability: +/-0.10A Reproducibility: +/-0.20A (Reloaded) Filtering band: Low band: 0.026 to 0,129 um - 1 (7.8 to 38 um) High band: 0.129 to 1.4 um - 1 (0.88 to 7.8 um) Full band: 0.026 to 1.14 um - 1 (0.88 to 38 um) Comp band: Selectable from 0.2 to 150 um Temperature: 5°C ~ 40°C Vacuum: -9.3 Pa OD Tube connector: 6mm Standard AC power code Power: AC 100-240 V, 50/60 Hz 2014 vintage.
SCHMITT INDUSTRIES TMS-3000WRC Mask & Wafer Inspection Equipment is a state-of-the-art, high-speed, non-destructive surface inspection and measurement system designed for the most demanding wafer and mask inspection applications. It is ideal for the semiconductor manufacturing industry, offering a high level of automation, sophistication and precision. TMS-3000WRC unit delivers superior resolution, extremely fast and accurate imaging, precise control and excellent repeatability. Its advanced optics, imaging, motion, and control machine provide the highest level of 3D measurements and topography images. Its intuitive software interface and easy to use graphical user interface allow for fast, accurate, and repeatable mask and wafer inspections. SCHMITT INDUSTRIES TMS-3000WRC tool is designed with a configurable turret which allows for up to four different sensors to be easily swapped. This allows for wide range of surface inspections including edge, drop size, breakage, defects, dopant, grain, absorbance, and reflections. It also offers automatic bright field and dark field light configurations, enabling precise morphological measurements including roughness, flatness, particle size, and oxide thickness. TMS-3000WRC asset has a wide dynamic range which makes it capable of inspecting highly reflective surfaces at high speeds. Its state-of-the-art auto-focus feature also allows the model to maintain optimum focus for defect inspection across an entire mask or wafer surface. With an integrated pattern recognition technology, the equipment can easily distinguish between normal, minor, and severe defects on a mask or wafer. SCHMITT INDUSTRIES TMS-3000WRC system also features advanced image analysis and processing algorithms, which allow for quick and accurate results. Additionally, the unit also offers a wide range of accessories, such as high-accuracy linear stages, vibration-controlled inspection tables, and vision sensors, for more advanced mask or wafer inspection. Overall, TMS-3000WRC Mask & Wafer Inspection Machine is an unparalleled solution for the most demanding mask or wafer inspection applications. Its wide range of features, precision and automation make it one of the best systems in its class.
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