Used DISCO DGP 8760 #9166427 for sale

DISCO DGP 8760 is a state-of-the-art wafer grinding, lapping, and polishing equipment. This system enables users with an automated solution for various grinding applications. The unit can handle a single wafer up to an 8 inch size diameter and a maximum thickness of 7.5 mm with a maximum weight of 300 grams. DISCO DGP8760 is equipped with the latest technologies and automation capabilities to ensure precision grinding and polishing of a wide variety of wafer materials. The machine houses a grinding head, lap plate, platen, and polishing pads that are all adjustable for precise control of process variables. The superior wafer pre-alignment tool incorporated into the asset's main body guarantees minimal movement of wafers and enables accurate grinding to high levels of precision. For perfect grinding and polishing of highly sensitive materials, DGP 8760 model pairs advanced abrasive media with the latest in vibration-free air grinders, lapping guides, and polishing systems. The equipment operates on a three-step process in which the grinding head starts by pre-grinding the wafer to a predefined planar shape. This step uses a specially designed cartridge head with abrasives that are designed to reduce material removal time with minimal material loss. After pre-grinding, the user can adjust the lap plate to lapping the wafer with the polishing media that is held in place with a vacuum chuck designed to adhere to the wafer. The user can then finish the process with the polishing system to reach the desired surface finish. An integrated timer collects and stores process time information and also allows for customizing of process parameters. Through remote control, DGP8760 unit can be accessed through a web browser for data logging, maintenance, and operation processes, enabling users to view precise information. DISCO DGP 8760 is the ideal choice for process optimization and providing consistent and unmatched precision wafer processing in a production environment. With the integrated air grinder and polished surface monitoring, this machine ensures high accuracy and smooth finish surfaces suitable for all varieties of wafer materials.