Used DNS / DAINIPPON 629 #9218807 for sale

DNS / DAINIPPON 629 is a chrome-free, positive-tone, near-UV photoresist designed specifically for lithographic processes. It is an aqueous-based, near-UV photoresist, which provides higher resolution in photolithography than traditional organic developers. The main component of the resist is polyvinylpyrrolidone (PVP), a polymer used to improve aqueous solubility. It also contains a photo-initiator, a catalyst that allows the other components to degrade faster upon photo-exposure. In addition, it contains an acid generator, such as maleic acid, that acts as a buffering agent. The resist also has an alkaline component such as sodium hydroxide or potassium hydroxide, which helps to reduce the surface tension of the resist to promote adhesion to the substrate. In addition, the resist features a catalyst, such as a tertiary amine, which enables post-exposure development upon exposure to near-UV light. The key to the success of DNS 629 photoresist equipment is its superior adhesion to non-conducting substrates. It is also resistant to high temperature and radiation, making it suitable for use with high-temperature processes and in the presence of electron beams (EB). The resist is a negative-tone, meaning that the unexposed portions of the resist are dissolved away by the developer upon development. The exposed portions, however, remain largely intact, resulting in a pattern that is ready for deposition of the desired metallization. The resist can also protect the substrate surface during etching methods as well. The main use for DAINIPPON 629 photoresist system is in microelectronic and optoelectronic device fabrication. It can also be used in photomask making, integrated circuit fabrication, and other high-resolution lithography processes. The unit is also capable of addressing low and high geometries, and can be used for various types of substrates. 629 photoresist machine is a powerful tool for device fabrication, and provides excellent performance in lithography processes. Its durability, excellent adhesion to non-conducting substrates and resistance to high temperature and radiation make it a suitable choice for lithography-intensive processes.