Used ACCRETECH / TSK UF 2000 #9234261 for sale

ACCRETECH / TSK UF 2000 is a prober designed for wafer fail analysis, wafer pre-tape design and automation testing. The equipment is built on a modular platform, allowing flexibility and scalability for production lines. The system features a mapping unit that automatically detects probe positions and automatically calibrates the wafer mapping by using forward map scanning. The integrated probe machine features high precision probes (max. 0.2 µm accuracy) and several downstream features such as manual override, X-Y travel, wobble and scan site adjustment. The tool also includes a powerful image processing algorithm that detects probe tip shapes and performs auto guard banding of contact and non-contact surfaces. The algorithm uses a combination of static and dynamic scanning methods to identify and segregate on-die pad geometries, contact points, insulation layers, and contacts areas. This helps to provide non-contact probing capabilities and reduce the risk of touching the circuit and causing damage. The asset allows for manual or automated testing of wafers from various semiconductor devices. After setting up the wafer alignment and probing, TSK UF 2000 can run the sequence from start to finish with minimal user intervention. The model can simultaneously probe up to 106 sets of 500-pin wafers. The equipment's automated model can reduce total testing times with higher accuracy and repeatability. The system also integrates with existing equipment to create a complete automation solution for an entire wafer testing process. ACCRETECH UF2000's comprehensive features make it an ideal tool for wafer fail analysis, pre-tape design, and automated testing applications. It is reliable, easy to use and highly customizable, providing a cost-effective approach to wafer probing, handling, and testing.