Used SEMICS Opus3 #9220173 for sale
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ID: 9220173
Wafer Size: 12"
Vintage: 2017
Prober, 12"
Linear stage system
Cassette map with sensor
Motorized 3 leg
VNC Support
5 Fixed tray
Specification:
Thickness: 300 µm - 2000 µm
Die size: 350 µm - 100,000 µm
Prober card handling:
Shape: 350Φ/480Φ/520Φ
Thickness: Maximum 50 mm
Prober unit:
Position accuracy:
X/Y: ± 1.0 µm, Z: ± 1 µm
Contact accuracy:
X/Y: ± 1.0 µm, Z: ± 1 µm
X/Y Probing area:
X: ± 175 mm
Y: ± 185 mm
Maximum speed: 500 mm/s
Z Axis:
Z Stroke: 40 mm
Contact setting range: 1-10 mm
Drive method: AC Servo motor
Accuracy: ± 1 µm
Maximum speed: 50 mm/s
Rigidity for needle force: 300 kg
Θ Axis:
Rotation stroke: ± 5.0°
Drive method: Stepping motor
Control resolution: 0.0001°
Chuck top:
Planarity: ≤ 10 µm at Ambient
Temperature range: Ambient ~ 150°C
Alignment method:
Image pattern matching
Optic auto-focus
Loader rotation axis:
Maximum rotation speed: 270°C /sec
Drive method: Stepping motor
Control resolution: 0.006°
Pre-aligmnent unit:
Maximum rotation speed: 360°/sec
Accuracy: X,Y ± 100 µm
Control resolution: 0.036° (R=150 mm, 95 µm)
Computer:
CPU: I5 Dual core 2400 3.0 GHz
HDD: 500 GB
Memory: 3 GB
System disk: USB
Monitor: Touch screen, 15"
OS: Window XP
2017 vintage.
SEMICS Opus3 is a multi-parametric process optimization tool widely used across industries for process monitoring and control. It is a multi-purpose tool, suitable for both large and small scale operations. SEMICS OPUS 3 is capable of performing both statistical and predictive analytics to gain insight into manufacturing processes and identify potential areas of improvement. It works by monitoring and collecting raw process data and post-process information which is used to analyze trends, uncover root causes of variation, and improve process parameters. Opus3 utilizes advanced process monitoring algorithms to do root cause analysis and identify process parameters which could result in product quality or process consistency improvements. The software allows users to make in-depth process changes and monitor their effect on process yield, product quality, and process consistency. Additionally, OPUS 3 provides preventive maintenance and production scheduling capabilities which can aid in optimizing production cycle times and reduce downtime. Furthermore, the software offers statistical tools such as basic Statistical Process Control (SPC) charts, parametric analysis, capability studies, and prediction models which aid in process optimization. SEMICS Opus3 also provides powerful real-time data visualization and reporting tools to enable users to quickly view process performance and potential areas of improvement. These tools allow users to identify, audit, and analyze complex trends, detect abnormalities in process performance, and create reports detailing process optimization history changes. The software also includes built in hardware and software interfacing I/O signal conditioning, signal conversion, and control functions for effective process management. This allows users to control and monitor complex equipment operations using an intuitive graphical user interface (GUI). Furthermore, the software supports various communication protocols to facilitate secure data collection and inter-machine collaboration. Overall, SEMICS OPUS 3 is a powerful and versatile process optimization tool with a range of advanced features. It provides powerful real-time analytics tools to help identify and improve process parameters, as well as powerful monitoring and control features to minimize downtime and optimize production cycle times. In addition, its wide range of interfacing and communication protocols make the software suitable for a wide range of industries.
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