Used AG ASSOCIATES Heatpulse 8108 #9226004 for sale

AG ASSOCIATES Heatpulse 8108 is a high-resolution rapid thermal processor designed for research and production of semiconductor wafers. This processor is capable of maintaining precise thermal characterization and control over the entire range of wafer temperatures from cryogenic temperatures to over 1,400 degrees Celsius. It is ideal for handling wafers with thin film and multi-layer processes, as well as for making and testing devices. AG ASSOCIATES HEAT PULSE 8108 features an advanced, high-resolution rapid thermal processor with rapid thermal profiling that quickly performs all operations related to Heat Distribution, Degassing, and Ion Implantations. With its fast ramping speeds and low-power heating element technology, wafer fabrication can be achieved within a matter of minutes. The thermal system is further configured with an integrated, programmable controller for independent, accurate control of temperature, pressure, time, and other conditions for performing various processes. Furthermore, this processor can make a variety of measurements, including, but not limited to, temperature and current, voltage, time, and pressure. This operation mode allows users to perform a sequence of operations autonomously, and monitor the conditions of the process in real time. In addition, this processor is designed with an optional advanced, proprietary PID control algorithm for increased control accuracy. The processor is also equipped with numerous safety features, such as an auto-shutdown function, automatic pressure control, over-temperature protection and H 2 O protection. The safety features ensure optimal safety and extend the longevity of the system. This processor also includes an integrated vacuum port, an elevated port, and multiple I/O ports to allow for connection to external systems, sensors, and other hardware for connection to a PC with real-time monitoring and control. HEATPULSE 8108 is a comprehensive rapid thermal processor tailored for research and production of semiconductor wafers. Its advanced design and features make it the ideal choice for thin-film and multi-layer fabrications. With its superior rapid thermal profiling, low-power heating element technology, advanced PID control algorithms, and built-in safety systems, Heatpulse 8108 is the perfect solution for maximizing efficiency and productivity in semiconductor wafer fabrication processes.