Used AIXTRON TS OCSH 30X2 #9181587 for sale

AIXTRON TSCOH 30X2 is an all-in-one chemical vapor deposition equipment that is capable of depositing a wide range of functional materials including organic compounds, nitrides, oxides, and alloys. It is designed to offer both high process flexibility and excellent uniformity and control. AIXTRON TSCOH 30X2 is equipped with two distinct process chambers, each equipped with a dedicated set of components. The first chamber offers Reduced Pressure Epitaxy (RPE) and chemical vapor deposition (CVD) capabilities with chamber pressures ranging from 0.005 to 20 torr. This chamber features an upper heating stage with a susceptor heater, while the lower heating stage consists of a media heater and piston. The movement of the upper and lower stages can be independently controlled up to 200 mm/s. The second chamber of AIXTRON TSCOH 30X2 is a higher temperature processing chamber designed for solid-source MBE processes. This chamber features an upper heated stage, with a hafnium band heater, and a hot dipole assembly as the lower staged component. This chamber can accommodate process pressures ranging from 0.001 to 50 torr. In order to maximize layer uniformity and provide accurate and precise control over processes, AIXTRON TSCOH 30X2 includes pressure control, temperature control, and mass flow controllers. The system is capable of providing rapid temperature cycling, for consistent performance, and powerful computer-assisted process analysis. Additionally, the unit allows for remote control of material deposition processes and multi-zone control of the process chamber for precise temperature control. Safety and quality assurance are important features of AIXTRON TSCOH 30X2, as the machine features a fully integrated safety interlock tool, as well as an integrated gas leak detection asset (N2O monitoring. The model's fully automated operation helps to ensure high process uptime and consistent process yields. In summary, AIXTRON TSCOH 30X2 is an all-in-one polymer and semiconductor deposition solution that is designed for maximum flexibility and precise control. It is capable of depositing a broad range of functional materials and allows for advanced parameter control for accurate and reliable results.