Used AMAT / APPLIED MATERIALS P5000 #9214227 for sale

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AMAT / APPLIED MATERIALS P5000
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ID: 9214227
Wafer Size: 6"
System, 6".
AMAT / APPLIED MATERIALS P5000 is an advanced reactive ion etcher (RIE) system meant to be used with materials such as silicon wafers and other hard materials. It is designed to offer improved etch rate uniformity, etch selectivity, and process repeatability by using powerful ion bombardment and uniform plasma generation. The chamber of AMAT P-5000 is constructed of stainless steel and is enclosed in such a way as to limit pollutants and particles from entering the process. It is available with options for a loadlock, wafer handling systems and gas delivery systems. APPLIED MATERIALS P 5000 is identical to APPLIED MATERIALS P5000 Plus, the only difference being the inclusion of a pressure controller in the Plus model. AMAT P 5000 is equipped with an Electron Cyclotron Resonance (ECR) source to directly generate a high density plasma with an even distribution of ions. This unique feature sets P5000 apart from conventional RIE systems. It also includes a high-power HF matching network, which is capable of generating a very wide range of etch powers. AMAT / APPLIED MATERIALS P 5000 features a dual-frequency gas injection system which delivers etching gases at different pressures to maintain pressure uniformity across the entire chamber. The interface of the system is user-friendly, allowing for easy programming of complex etch recipes. AMAT / APPLIED MATERIALS P-5000 can be used for etching applications in a wide variety of materials, including silicon, glass, quartz, and sapphire. It can be used for etching hard materials into substrates, such as integrated circuits and wafer level packaging components. It is also capable of deep anisotropic etches, which is a unique feature that few other RIE systems can offer. P 5000 offers many advantages when used for etching hard materials. It can provide an extremely uniform etch rate and highly reproducible etch results. Its wide range of etch powers makes it suitable for various applications. The uniformity of the ion bombardment also helps to maintain the same etch rate across the entire substrate. Its robust construction ensures long-term reliability and reduced maintenance costs.
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