Used ASM Eagle 12 Rapidfire #9283372 for sale

Manufacturer
ASM
Model
Eagle 12 Rapidfire
ID: 9283372
Wafer Size: 12"
Vintage: 2005
CVD System, 12" Chamber A, B and C: Process: P-TEOS/TMP Hard: CVD Gases (SCCM): Ar (7000) Ar (500) He (2000) N2 (5000) NF3 (3000) O2 (3000) TEOS (300) TMP (60) RPU: 400 kHz / 3000 W HRF: 13.56 MHz / 1000 W LRF: 430 kHz / 1000 W 2005 vintage.
ASM Eagle 12 Rapidfire is a professional-grade bonder that is designed to attach the ends of wire to various substrates. This is accomplished by using an electromechanical equipment to rapidly strike and release accurate, uniform feed bonds at levels of up to 12-15 kHz. This boding system is ideal for applications requiring guaranteed bonding integrity, fast speeds, and superior accuracy in comparison to other bonding methods. Eagle 12 Rapidfire utilizes a heated core which is energized by a high voltage power supply. This core, along with its associated control unit, produces three force levels with total voltage range of 0-350 V and force range of 0-30 N. This parameter range is suitable for most bonding applications. The core is also temperature adjustable from 0-150°C and is designed to optimize the bond strength in different substrates. ASM Eagle 12 Rapidfire also features a robust frame machine with precision ground steel bearing blocks for uniform movement along with steel plate weldments which provide stable contact points for the core and reduce vibrations. This sturdy construction ensures that the bonder can be used in reliable and repeatable conditions. Eagle 12 Rapidfire boasts a simple tool setup and ease of use. With an adjustable core speed up to 12-15 kHz, this boding asset is best suited for high volume wires and strips, wire harnesses, and component attachment. The integrated force feedback model ensures uniform contact force per feed level for precise wire end geometries as well as a high quality sealant on the wire end. The core also has an ergonomically designed handle and can be operated with one hand. ASM Eagle 12 Rapidfire is a user-friendly bonder that can handle most wire and substrate combinations. With its fast speeds, precision accuracy, and simple setup, this boding equipment is an ideal choice for high-volume, reliable and repeatable bonding.
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