Used ACCRETECH / TSK AWD-300T #9380395 for sale

ACCRETECH / TSK AWD-300T is a specialized scribing / dicing equipment designed to meet the needs of wafer, glass, and other non-metallic materials processing. This system employs a specifically designed spindle combined with a superior profile accuracy that is easy to use and maintain providing clean and accurate cuts for wafer slicing, glass fiber splitting, and other operations. TSK AWD 300T is engineered to achieve high accuracy of scribing, dicing, and other processes that require precise cuts. ACCRETECH A-WD 300T comes with a fixed table configuration and two independent digital stepper motor spindles to provide the simultaneous rotation of both axes with the help of an automatic tool changer, which allows quick material throughput with minimal operator intervention. This unit can perform a wide variety of cutting operations such as scribing, dicing, slicing, and drilling, and is fully capable of high speed cutting as well as high accuracy applications. The spindle of ACCRETECH AWD 300T is belt-driven with a speed range of 0 to 20000 RPM with a precision of 1 RPM and feed rate range of 0 to 1000 mm/minute with a precision of 1 mm/minute. This machine is equipped with a high precision guide wheel driven by track and a powerful micro-stepper motor for the precise positioning of cutting tools, ensuring accurate rotation and positioning around the material being cut. The safety feature of AWD 300T includes protection of the scribing / dicing tool with a transparent acrylic window and emergency stop switch. The whole asset is housed in a dust-proof box, making it suitable for cleanroom environments. In addition, ACCRETECH / TSK AWD 300T has an intuitive graphic user interface, a USB port for programming with user-friendly controls, and automatic tool placement and changing. It is also compatible with a wide range of compatible cutting tools such as blades and drills, making it suitable for a variety of materials. ACCRETECH A WD 300 T scribing / dicing model is the perfect choice for high-precision wafer slicing, glass fiber splitting, and other cutting operations. With superior profile accuracy and user-friendly control, it provides reliable performance throughout its long service life.