Used DISCO DFD 6340 #9098377 for sale

DISCO DFD 6340 is an advanced scribing/dicing equipment, combining the latest developments in precision technology to produce high quality and high density microelectronics components and devices. It utilizes laser ablation technology to cut small and complex shapes and patterns as well as cutting thin layers into substrates and wafers. Using its proprietary diamond blade, the system is capable of cutting and ablation with accuracy of up to 0.1um, offering manufacturers greater control and precision when processing microelectronics components and devices. The high performance motor provides excellent accuracy and speed, allowing the machine to process quickly and efficiently. DISCO DFD6340 offers a wide range of application for the production of subtle electrical components and components for the microelectronics industry. The easily upgradable components are made to exacting standards, offering both cost and space savings when manufacturing. The machine can cut pre-determined geometric shapes, optical fibers, thin-film materials and conductive tracks with ease. Due to its flexible cutting head and automated processes, the diamond blade can produce complex patterns as well as cut straight, curved and beveled edges. The unit features advanced "rapid mobility" technology, allowing it to quickly adjust to any size or shape that needs to be cut. In addition, the machine is designed with a self-teaching capability, allowing it to learn and remember the optimal cutting speed for each component or device. This feature also makes it easy for operators to set up and maintain the proper cutting speeds for multiple products in different shapes and sizes. Lastly, DFD 6340 includes an integrated vision tool that allows it to identify shapes and components and make corrections as needed. This asset can also be used to accurately measure the cutting speed and accuracy of each component, allowing producers to ensure the quality and consistency of their products. All in all, DFD6340 is an advanced scribing/dicing model that helps manufacturers produce high quality and high density microelectronics components and devices. Combining multiple technologies and advanced features such as rapid mobility, self-teaching capabilities and integrated vision, it provides manufacturers with the precision and control they need to effectively produce the most delicate components.