Used DISCO DFD 6340 #9284125 for sale

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Manufacturer
DISCO
Model
DFD 6340
ID: 9284125
Wafer Size: 8"
Dicing saw, 8" Work piece size: Φ8 X-axis: Cutting range: 210 mm Cutting speed: 0.1 - 600 mm/sec Y1-Y2 axis: Index step: 0.0001 mm Index positioning accuracy: 0.003/210 mm (Single error 0.002/5) Z-axis: Max stroke: 19.22 (For Φ2" blade) / 19.9 (For Φ3" blade) Moving: 0.00005 mm Repeatability accuracy: 0.001 mm Θ-axis: Max rotating angle: 360° Spindle: Torque N.m: 0.19 (1.2 kW) 0.29 (1.8 kW) 0.7 (2.2 kW) Revolution speed range: 6,000 - 60,000 min^-1 / 3,000 - 30,000 min^-1 2003 vintage.
DISCO DFD 6340 is a high performance scribing and dicing systems for semiconductor manufacturing. It is an ultra-precision equipment, capable of scribing and dicing with superior accuracy, providing higher yields and throughputs, with low cost of ownership. The system is equipped with twin synchronized flying optics, which provide a higher level of accuracy and reliability than conventional fixed optics systems. This allows for the scanning of wide areas, thereby eliminating defects and producing higher yields than non-scanning systems. The scan pattern can be programmed for various matrices and can switch between scribes and cuts, depending on the material and application. DISCO DFD6340 also has a high-speed dry pump, eliminating the need for cooling gases, and features a dust-free work chamber. The dry pump also ensures maximum efficiency, reliable operation, and a quiet environment. An ergonomic design allows users to stand and control the unit, while providing greater flexibility and control. The integrated dual-beam laser machine is capable of cutting varying heights up to 4mm, providing higher accuracy and faster cutting rates. The lasers can be adjusted to different wavelengths to match the material being cut, and the dual-beam tool allows scribing and dicing at the same time. The advanced control asset allows for automated adjustment of cutting depth, pitch, width, and aspect ratio. It offers high-quality, high-speed processing of arbitrary shapes, and automatic laser power control for difficult-to-cut materials. This ensures maximum processing efficiency and superior performance. DFD 6340 is tailored for cutting and forming semiconductor devices. It is capable of handling plated substrates, semiconductor wafers up to 8-inch diameters, and produces superior results with ultra-hard metals and resists. The user can quickly and easily input data and modify the cutting design, ensuring maximum performance and efficiency. The intuitive operation and control model of DFD6340 are designed to simplify and improve user experience. The equipment allows the user to save time by programming cutting patterns in advance, and allows quick access to key parameters without leaving the operating screen. Common parameters such as laser power, scanning speed, work chamber temperature, and others can be easily adjusted without sacrificing accuracy or throughput. DISCO DFD 6340 is designed with the latest technologies to provide maximum performance and efficiency. The combination of precision optics and advanced control makes it an ideal choice for the semiconductor industry. With high accuracy, speed and quality, DISCO DFD6340 offers a cost-effective solution for the most demanding applications.
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