Used DISCO DFD 6362 #9293472 for sale

DISCO DFD 6362 is a scribing/dicing equipment used to create chip-level components from silicon wafers. The system is composed of a high-precision silicon wafer scribing unit, a dicing saw unit, and a vacuum chucking machine. The high-precision scribing tool is capable of precisely scribing the wafer into the required chips. This asset is composed of a Y-Axis robot and a X-Axis stage. The X-Axis stage is capable of moving along the X-axis while the Y-axis robot precisely scribes the wafer. The model is also capable of scribing along both the X and Y axes, allowing for the creation of chips in irregular shapes. The dicing saw unit is used to cut chips that have been scribed by the scribing equipment. This unit is composed of a vacuum chucking system, a diamond-imbedded blade, and a CPU-controlled saw motor. The vacuum chucking unit firmly holds the chips in place for accurate sawing, while the diamond-imbedded blade is capable of cutting material with minimal surface damage. The saw motor is controlled by a CPU, allowing for precise movements of the blade. The vacuum chucking machine is used to securely hold chips in place during the scribing and dicing processes. This tool is composed of an electro-pneumatic vacuum asset and a chucking mechanism. The vacuum model is capable of providing a secure environment, while the chucking mechanism is used to firmly hold the chips in place. In conclusion, DISCO DFD6362 is an advanced scribing/dicing equipment used for the fabrication of chip-level components. This system is comprised of a high-precision scribing unit, a dicing saw unit, and a vacuum chucking machine. All three components work together to ensure the fabrication of high-quality chips with minimal surface damage.