Used DISCO DFD 6362 #9388822 for sale

It looks like this item has already been sold. Check similar products below or contact us and our experienced team will find it for you.

Manufacturer
DISCO
Model
DFD 6362
ID: 9388822
Vintage: 2013
Dicing saw Dual spindle Power: 1.2 kW 2013 vintage.
DISCO DFD 6362 is a scribing/dicing equipment used in the fabrication of semiconductor dies. The system has an X-Y table with two independent stylus holders for controlled cutting and drilling operations. It is an automated unit controlled by a computer that allows the simultaneous, multi-axis operation of two independent stylus holders. The machine can easily be programmed with a personal computer (PC) to perform multiple operations of scribing, dicing, cutting, drilling and taping. DISCO DFD6362 provides a high accuracy of cycling of 0.05 mm with 0.01 mm resolution in the X-Y direction and 0.015 mm resolution in the Z-direction. The machine is equipped with a heavy-duty X-Y manipulation tool and two independent stylus holders that allows up to 4500 rpm at a maximum acceleration of 10 m/s2 in the X and Y directions. The asset also has a max operational force of 5 kgf. The high-speed, high-accuracy model is ideal for complex scribing and dicing patterns, providing efficient processing for high volume applications. The equipment has built-in safety features that protect valuable hardware from damage and ensures continuous operation. The system is also equipped with an integrated vision unit and coordinates measuring machine to ensure accurate measurements of any pattern desired and provide the highest quality results. DFD 6362 has a 6-head cutting unit that allows increased throughput and improved product quality. The machine also has a built-in laser reader that is programmable with the PC for spot inspection of finished dies. The tool is capable of processing a variety of materials ranging from PCBs to ceramic substrates and stainless steel components. Overall, DFD6362 is a highly efficient, accurate and reliable scribing/dicing asset for high volume semiconductor processing. Its features, such as its multi-axis operation, powerful cutting and drilling model, integrated vision equipment, and integrated laser reader, make it a powerful and versatile system for the fabrication of dies.
There are no reviews yet