Used DISCO DFD 641 #9155087 for sale

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Manufacturer
DISCO
Model
DFD 641
ID: 9155087
Wafer Size: 8"
Vintage: 2000
Dicing saws, 8" X-Axis Cutting speed: 0.1 - 450 mm/s Y-Axis Accuracy: 0.003/210 mm Single error: 0.002/5 mm Z-Axis Max stroke: 7.2 mm(for Ø2" blade) Repeatability: 0.001 mm Max blade size: Ø55.56 mm T-Axis Max rotating angle: 380 deg Spindle Output: 1.0 at 60,000 kW Rated torque: 0.16 N.m Revolution speed range: 6,000 - 60,000 (min-1) 2000 vintage.
DISCO DFD 641 is a state-of-the-art scribing and dicing equipment used in the electronics manufacturing process. This system is capable of producing feature sizes that range from ten to one hundred microns. The unit is designed to process a variety of materials including silicon, quartz, and ceramic to support the production of high-resolution microelectronic components. The machine utilizes a diamond-tipped scriber on a high-powered drive tool to perform the cutting operations. This scribing technology enables precise cutting of features with very accurate positional control. It also reduces the splintering of the substrate material, resulting in a smooth cutting surface with little damage to the material. The asset is equipped with an optical measurement model for precise measurement of feature edges using laser interferometry. This measurement equipment is capable of measuring product features with extremely high accuracy. With its integrated graphical user interface, features can be created quickly and accurately. DISCO DFD641 also offers a dicing option to support the production of higher-performance and higher-reliability parts. This process uses a diamond-coated blade to separate substrates into die-level pieces. This dicing process offers a more robust and reliable cutting for device production. The system also incorporates a cleaning station to remove any particles or debris created during the scribing and dicing operations. A filter unit is also designed to capture any airborne particles so that the process environment remains clean. DFD 641 is a versatile and reliable machine for producing high-precision microelectronic components. It is easy to integrate with other production processes, and offers a cost-effective solution for mass production. Its cutting-edge technology provides customers with reliable, high-resolution substrates and components.
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