Used DYNATEX DX-III #77391 for sale

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DYNATEX DX-III
Sold
Manufacturer
DYNATEX
Model
DX-III
ID: 77391
Wafer Size: 4"
Scribe & Break system, 4", MS DOS based computer control, dry scribe and anvil impact breaking system. Version 2.40 boot, 2.65 Eprom.
DYNATEX DX-III is a scribing / dicing equipment designed to facilitate precise patterning of materials. It is an automated system which utilizes high-frequency ultrasonic vibrometers in order to create very precise patterns in a quick and efficient manner. It can cut through a variety of materials, including laminate materials, plastics, glass, and composites. The unit consists of a vibrating table and a scanning head.The vibrating table is made from high-grade stainless steel and is built to withstand harsh conditions. The scanning head is connected to the table by a precision spindle, allowing for precise and repeatable movement of the head. The head is equipped with a hydro-piercing device which can cut through materials that ordinary scribing systems cannot handle. The machine's software allows for accurate programming of scribing and dicing processes, allowing users to create patterns with incredibly precise tolerances. The user can create patterns with a scan area of up to 500mmx500mm and with a scan resolution of up to 0.1mm. The tool is also capable of cutting through textured materials, as well as soft materials such as foam and rubbers. Overall, DX-III is a powerful and reliable scribing / dicing asset which can produce precise patterns with a minimum of effort. It is a fast and efficient model for achieving results in short lead times, and is ideal for applications such as die cutting, wafer slicing, and thin film slicing. The equipment's software is highly versatile and can be used to create patterns with a variety of tolerances, making it suitable for a wide range of materials and applications.
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