Used TODAKA (Scribing / Dicing) for sale

TODAKA is one of the leading manufacturers of scribing and dicing equipment in the industry. Their systems are known for their reliability, precision, and efficiency. The scribing units from TODAKA enable the separation of various types of materials, such as silicon wafers, glass substrates, and ceramics, through a controlled cutting process. These machines utilize advanced technology, including high-speed spindles and a precise alignment mechanism, to achieve accurate and clean cuts. One of the notable products from TODAKA is the JW-100 II. This scribing system offers a range of features including a high-speed spindle capable of up to 60,000 rpm, a non-contact sensor for part alignment, and a user-friendly interface for easy operation. The JW-100 II is widely used in the semiconductor industry for wafer dicing applications. The advantages of TODAKA's scribing tools include reduced material waste, improved process efficiency, and enhanced product quality. These assets are designed to provide stable and consistent performance, ensuring high yield and reducing production costs. Additionally, TODAKA offers excellent customer support, including training and technical assistance, to help customers optimize their scribing and dicing processes. Overall, TODAKA's scribing and dicing models are highly regarded for their precision, reliability, and cost-effectiveness. These equipment have become a preferred choice for various industries, including semiconductors, electronics, and optics.