Used CANON / ANELVA C-7730FH #9167768 for sale

CANON / ANELVA C-7730FH sputtering equipment is an advanced sputter deposition system designed for production purposes. CANON C-7730FH is engineered for reliable and reproducible results, with a wide range of excellent sputter deposition parameters and features. It is ideal for applications such as thin film deposition, deposition of passivation layers, and formation of protective layers. ANELVA C-7730FH is a dual chamber, row-by-row configuration with a unique design to maximize productivity and accuracy. The sputter unit can be configured with up to three sputter sources, allowing for the independent operation of each source. It also features a high-precision sample port positioning machine for accurate and repeatable sample positioning. The sputter sources come with shadow masks for uniform sputter deposition of films in large areas. C-7730FH utilizes CANON proprietary electro-pneumatic tool for sputtering control. This asset allows a high degree of precision in controlling both the deposition rates of materials as well as their uniformity. The model also has a low sputter rate decay, preventing material wear and tear in the long run. CANON / ANELVA C-7730FH also boasts a stable and long-term uniformity of films. The equipment's superior uniformity ensured uniform deposition in large areas through its electro-pneumatic system and shadow masks. CANON C-7730FH has a high deposition rate of films, with a wide range of sputtering conditions that can provide films with different characteristics. ANELVA C-7730FH is also equipped with a ground fault interrupter, to protect against electric shock. The unit also features an anti-static machine to minimize static electricity accumulation and potential damage to the tool. C-7730FH is designed for ultimate reliability, with a minimal need for maintenance services. Overall, CANON / ANELVA C-7730FH sputtering asset is an advanced and reliable sputter deposition model that features a wide range of excellent sputter deposition parameters. Its dual chamber, row-by-row configuration maximizes productivity and accuracy and is ideal for the formation of protective layers, thin film deposition, and passivation layers. The equipment's electro-pneumatic control, high-precision sample port positioning system, and shadow masks lend to excellent film uniformity, while its ground fault interrupter and low sputter rate decay ensure reliability and long-term stability.