Used CANON / ANELVA ILC 1060SV #181556 for sale

CANON / ANELVA ILC 1060SV is a multi-functional sputtering equipment designed for a variety of industrial and research applications. Sputtering is a form of physical vapor deposition which involves a vacuum chamber and an ionized gas. In this sputtering system, particles from the target material are accelerated by an electrical field and bombard a substrate, resulting in the transfer of material onto the surface of the substrate. CANON ILC 1060SV unit has several features that make it particularly well-suited for producing uniform films of both electrically-conducting and dielectric materials. The machine consists of a vacuum chamber, two load locks, and a pumping tool. The chamber is equipped with a 10 kW power supply, a high power target asset, and a digital feedback monitor. The target model consists of a fixed source and a rotating source to allow for broad coverage of all angles on the substrate. The high power source is capable of producing high power outputs which translates to higher deposition rates for some applications. The pumping equipment utilizes a pair of turbomolecular pumping stages and a cryogenic pump to achieve a vacuum of 10-5 Torr. This enables a wide range of substrates from polymers to metals to be sputtered onto. The dual load locks create an airlock system and allow for quick loading and changing of substrates. ANELVA ILC 1060 SV unit is designed for precise layer formation and is equipped with advanced control parameters to allow for repeatable layers as thin as 10nm to be achieved. This is done by allowing the control of substrate-target distance, both source and target power, process gas pressure, and bias voltage and current. Special feature of the machine is that it has a fast process interface which allows for easy transition between parameters between processes. The fast process interface and the precise layer formation make the tool ideal for creating uniform films and complex layers. ILC 1060 SV is a versatile sputtering asset that is suitable for a variety of applications. With its advanced control parameters, precise layer formation, and advanced features, it is highly suitable for applications that require uniform films and complex layers. The model can be used to produce films of both electrically conductive and non-conductive materials, and it is designed to achieve high deposition rates due to its high power capabilities. The airlock equipment and fast process interface enable quick changes between substrates and processes, making it suitable for high throughput applications. Overall, this system is an excellent tool for a variety of research and industrial applications.