Used CPA / KURDEX System #182506 for sale

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ID: 182506
Sputtering system.
CPA / KURDEX Equipment is a sputtering CPA System designed to deposit thin films onto various substrates. It consists of an electron beam gun attached to an ultra-high vacuum chamber, a wafer holder, a collimator, a control module and a high-vacuum pump. The electron beam gun is used to generate electrons that are focused onto a target material in the vacuum chamber. Through the application of electric fields, the electrons are accelerated to high velocities and bombard the target material, causing it to erode and sputter off particles of material which become the film deposited onto the desired substrate. The collimator helps to ensure the electrons have a well-defined beam size, thus providing uniform coverage for the substrate. The wafer holder is important in keeping the substrate stationary and in the exact same spot when being exposed to the electron beam. It is also responsible for ensuring the substrate has the proper alignment and distance from the target material. The control module is an essential component of KURDEX Unit. It provides the necessary parameters such as voltage, current, and pulse duration to ensure that the correct amount of current is used to sputter the material. It also automatically adjusts the sputtering rate of the material by monitoring changes in the substrate temperature. Finally, the high-vacuum pump helps to evacuate the alumniums inside the chamber and supply the chamber with a continuous flow of clean and free inert gases, ensuring that the electrons travel a much greater distance to contact the target material, resulting in greater sputtering efficiency and more uniform deposition. To sum up, Machine is a highly efficient sputtering CPA / KURDEX Tool designed to deposit thin films onto various substrates. It is comprised of an electron beam gun, a wafer holder, a collimator, a control module, and a high-vacuum pump. CPA Asset is used to ensure uniform coverage and deposition of thin films with the use of electric fields and well-defined beam sizes. It also features automated features such as temperature control and current adjustments. The high-vacuum pump prevents any contaminants from entering the chamber and helping to ensure maximum sputtering efficiency.
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