Used Custom Sputter coater #9058402 for sale

A Custom Sputter coater is a specialized sputtering equipment, used to deposit a thin layer of material onto a substrate. It is a deposition process, where atoms or molecules of material from a metal target are accelerated to impact onto a target substrate as a collimated beam and form a thin film. The sputtering system generally consists of a vacuum chamber, an arrangement of magnets to create a field around the substrate, an arrangement of sputtering sources, a vacuum pump, a power supply, and a controller. The sputtering unit is a type of physical vapor deposition (PVD) technique, where material from the target is dislodged by the bombardment of inert gas ions, creating a flux of neutral atoms that travel to the substrate in a collimated beam. Sputtering gases including argon and others can be used to create high deposition rates and uniform coating of thin films. Custom sputtered coatings are made from materials such as gold, chromium, titanium, copper, aluminum, and more, with each material having a unique properties for different applications. The vacuum chamber for sputter coating is usually a cylindrical chamber, configured to create a uniform magnetic field around the target substrate, resulting in a high rate of sputtering. It is equipped with flanges for attaching the substrate holder, a substrate chuck, and a target holder. The process of sputter coating can vary depending on the material, but a typical process includes purging the chamber with argon to the desired level of vacuum, loading the substrate and the target material, heating the substrate and the target material to a specific temperature, followed by powering the machine. The power supply for Sputter coater is typically in the form of a DC-DC converter, which can provide multiple output voltages to power the sputter source. The target material is connected via an anode circuit, where the power supply is connected to the target and the grounding is connected via a metal bar. The feed-through flanges for power supply to the target are located on the top of the emission chamber. The controller supplies the power to the various components of the sputtering tool, which is adjusted according to the desired parameters. The controller also collects data from various parts of the sputtering asset, such as temperature, power, voltage, and more for analysis. Custom Sputter coaters can deposit a much thinner layer of materials than other thin film deposition techniques like evaporation, thus making them ideal for applications where precise layers are required. With the help of a variety of materials and sophisticated controllers, these Custom sputter coaters produce highly uniform layers with excellent morphology and reproduction.