Used CUSTOM Sputtering system #9063483 for sale

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CUSTOM Sputtering system
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ID: 9063483
Sputtering system Includes work table and controller.
A CUSTOM Sputtering equipment is an equipment used in the deposition of a thin film of metal or other materials onto a substrate through physical vapor deposition (PVD). This is used in the semiconductor, hard disk drive, flat panel display and optical industry applications. Sputtering system consists of a vacuum chamber, an inert gas, a heater, a cathode, an anode, a target material and a substrate holder. The vacuum chamber provides a means of obtaining an environment with very low pressure. This environment is used to prevent oxidation and contamination during the process. It is also used to reduce the number of collisions between the atoms travelling to the substrate. The chamber is then filled with an inert gas such as argon or nitrogen to provide long-term stable conditions. The heater is used to heat the chamber, allowing it to maintain the process temperature at a constant level and controlling the deposition rate. The cathode and anode are the electrodes that when powered create an electrical field which accelerates the target material across the chamber and towards the substrate. The target material is the material that is being deposited onto the substrate. It could be a single material or a combination of different kinds, such as copper, silver, gold and titanium. The target plate is mounted onto the cathode and heated by the heater. As it is heated, the atoms of the target material become excited and travel towards the substrate holder. The substrate holder is where the substrate material is placed. This is the material that the target material is being deposited onto. It is typically a glass or metal plate but could also be a ceramic or plastic material. CUSTOM Sputtering unit is then powered on, causing the electrical field between the cathode and anode to be activated. This results in the target material being ionized and ejected from the target plate towards the substrate. As the ions collide with the substrate, a thin layer of the target material is deposited. This process is repeated until the desired amount of material is applied to the substrate. By combining multiple targets in the same Sputtering machine, different designs and patterns can be achieved. The cycle time of the process is dependent on the size of the deposition area, the speed of the process and the power of the tool. The asset can also be customized to include additional process steps, such as heating the substrate before and after film deposition. CUSTOM sputtering systems are used to create complex and precise designs, such as those found in displays and optics. This process, combined with its flexibility and low cost, make it a great choice for a wide range of applications.
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