Used MRC 603 #9246783 for sale

MRC 603 is a sputtering equipment typically used in physical vapor deposition processes. It typically uses electronic bombardment or magnetron sputtering to activate bonded atoms in a substrate and deposit them on a second substrate. 603 is a multi-purpose system that utilizes three sources: two planar DC magnetron sputtering guns, and one rotating DC magnetron coater. Its design is based around a dual source platform which allows for the independent control of each source. Each gun has its own electronics with a set of dedicated process parameters such as power, shield-mode, speed, and tilt angle. The deposition process is controlled by a microcontroller unit (MCU). Its controller is extremely precise and allows for precise control over process parameters without any contamination of the substrates. Furthermore, the controller features an independent process monitoring unit, which provides users with real-time feedback and in-depth data regarding their process. MRC 603 also has a unique shielding setup that can lessen particles and contaminations created during the sputtering process. This is made possible by the combination of stationary shields and auxiliary shields. These shields are adjustable and can be tailored to accommodate almost any valve/distance configuration or physical sputtering setup. The shields, along with the dedicated DC magnetron sources, create a very efficient sputtering process that decreases contamination and reduces back streaming of sputtered particles. Additionally, the ability to tailor the process allows for the production of thin films with very thin thickness control achievability. 603 was designed to be an automated machine. Consequently, it contains many automated features, like a vibrating pole, to ensure uniform deposition on the substrate. With its automated pulsing and large substrate holders, MRC 603 is highly suitable for applications that require high throughput. Overall, 603 is a versatile and reliable sputtering tool that produces advanced thin film coatings with minimum contamination. Its sophisticated design and highly precise control asset can ensure uniform deposition and high-quality results. Additionally, its reliable shielding model ensures optimal process conditions and safe handling of sputtered particles.