Used MRC 903 series #9009095 for sale

MRC 903 series is a high-precision vacuum process equipment that utilizes the sputtering deposition technique. It is designed to provide advanced uniform coverage of thin films over a variety of substrates. MRC 903 utilizes the Magnetron Sputtering Process (MSP), which is a highly efficient, low-pressure carbon-based deposition process. This process is capable of yielding highly uniform coverage of thin films on a variety of substrates. The system is equipped with a robust set of features such as a low pressure chamber, up to three cathodes, a load lock chamber, advanced process control, and NIST traceable thickness measurements. The unit creates a vacuum environment by evacuating the chamber using the Turbo-Pumped Diffusion Type. This vacuum allows for the efficient and uniform sputtering process. The chamber supports up to three cathodes which are used to sputter target material onto the substrate. The cathodes are tuned via adjustment of the applied current and/or position of a cross-magnet arrangement for optimized coating uniformity. This machine is also equipped with an advanced process control tool which allows for the optimization of the process parameters. The asset also allows for the use of a two-step load lock chamber. The load lock chamber is used to introduce the substrate into the chamber without exposing it to the environment. When placed inside the lock chamber, the substrate is maintained by the vacuum to minimize the exposure of surrounding environmental gases. This helps to ensure the purity of the substrates and yields more reliable results. Once the desired thin films are desired, they are measured for accuracy using a NIST traceable thickness measurement model. This equipment accurately determines the exact thickness of the films being deposited. With 903 series, an even distribution of sputtered material can be achieved for complex geometries, making it an ideal choice for precision thin film coatings. Overall, MRC 903 series is a powerful sputtering system capable of providing high accuracy uniform thin film coatings over a variety of substrates. By utilizing the magnetron sputtering process, a low-pressure, efficient, and consistent process is allowed. Additionally, the advanced process control, NIST traceable thickness measurements, and two-step load lock chamber provide precision deposition of thin films.