Used MRC / MAT-VAC 943 #9173799 for sale

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Manufacturer
MRC / MAT-VAC
Model
943
ID: 9173799
Sputtering system.
MRC / MAT-VAC 943 is a versatile vacuum sputtering equipment developed by Taga Manufacturing Company for use in thin-film deposition applications. This system is capable of depositing a wide range of material properties on substrates such as glass, plastic, silicon, and ceramic with high degree of accuracy, repeatability and uniformity. The unit consists of two main components - the main chamber, which houses the cathode, and the vacuum enclosure, which is used to carry out the sputtering process. The main chamber is fed with either a Direct Current or Radio Frequency power source. Anode and cathode are connected in the chamber and the substrate is placed in between. The anode is the target material and the cathode attracts the sputtered material. The pressure in the main chamber is maintained by creating a vacuum with the help of pumps. A gas inlet is also present for controlling the other parameters in the chamber such as temperature, oxygen and argon levels. The temperatures in the chamber can range from 5°C - 1000°C and the pressure is adjustable from 0.5 mbar - 1000 mbar. The power input to the machine is adjustable from 0.01 A - 100 A and its frequency ranges from 1 kHz - 50 kHz. It is fast enough to achieve the sputter deposition rate desired. The tool is designed with safety features such as safety interlocking systems and gas alarms with touchpad inputs and detailed control operations. It also has user friendly graphical user interface and built-in data logging software, allowing users to carry out real-time monitoring and custom reporting functions. In addition, the asset is designed with an integrated vacuum model, using turbo molecular and diffusion pumps to maintain high ultimate pressures. The equipment is also designed with a temperature control system, allowing the user to maintain a constant temperature profile for the entire substrate surface during deposition. In conclusion, MRC 943 is a robust and reliable sputter unit with a wide range of parameters that can be adjusted to meet virtually any thin-film deposition requirements. It is well equipped to incorporate advanced technological advances such as radio-frequency sources and rapid high-end cooling systems. This machine is ideal for any application requiring high-accuracy and repeatable thin-film deposition with high levels of uniformity.
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