Used MRC / TEL / TOKYO ELECTRON Eclipse Mark IV #9199385 for sale
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ID: 9199385
Wafer Size: 6"
Sputtering system, 6"
Not included: Pumps
SPUT Process chambers:
SPUT1:
Cathode: RM-12
Magnet pack type: RMX
C/S Spacing: 2.0"
Adapter type: Profiled
Target material: TiW
Shield material: Plasma spray
(2) Pie pan shields
Gas ring
Reactive gas: No
Regas injection: Rear
Argon MFC size: 200 sccm
Backplane type: MXB
Quick cool type: Air
DC Power supply: 10 kW
Target change kit: No
RF Bias network: No
Fast regen cryo
SPUT2:
Cathode: RM-12
Magnet pack type: RMX
C/S Spacing: 2.0"
Adapter type: Profiled
Target material: Ru
Shield material: Plasma spray
(2) Pie pan shields
Gas ring
Reactive gas: No
Regas injection: Rear
Argon MFC size: 200 sccm
Backplane type: MXB
Quick cool type: Air
DC Power supply: 10 kW
Target change kit: No
RF Bias network: No
Fast regen cryo
SPUT3:
Cathode: RM-12
Magnet pack type: SPA
C/S Spacing: 2.5"
Target material: Au or Au/5%Ni
Shield material: SS
(2) Pie pan shields: No
Gas ring: No
Reactive gas: Kr
Regas injection: Rear
Argon MFC Size: 200 sccm
Backplane type: MXB HTB
Quick cool type: Air
DC Power supply: 10 kW
Target change kit: No
RF Bias network: No
Fast regen cryo
SPUT4: No
Etch:
Hard/Soft etch type: Soft etch ICP
Adapter type: New style
Quick change kit: No
Shield material: SS
(2) Pie pan shields
SE Adapter shield: No
Gas ring: No
Reactive gas: No
Regas injection: Door
Backplane type: Round
Quick cool type: Water
Variable ICP network: No
RF Bias network: Finger
Fast regen cryo
Bell jar cycle count
Loadlock/Plenum:
Loadlock atmosphere sensor: Old style
Plenum gate valve: Vat
L/L Cryo fast regen
Plenum cryo fast regen
RGA Type: No
Index cycle counter: No
Wafer handling:
Wafer:
Type: Si / SEMI
Tab type: Clamp
Clamp ring material: SS
C/R Edge exclusion: 1.5mm
Latch type: SS Bearing
MFC Vendor: MKS
Equipe/PRI Robot: CE
Equipe/PRI Controller: 100 Series
Index stepper cont. loc: Vacuum tank
Index drive type: Solarus
Aligner type: Equipe/PRI
L/A Latches enabled
SMIF Interface: No
Laminar blower
Facilities/Utilities:
Pump: QDP80
AC Voltage: 208 V
AC Frequency: 60 Hz
PDU Set for 50 Hz: No
208 Buss bar in PDU
GFI in PDU
Cryo compressor type: 9600
Compressor power / Pump power from PDU
Water lines
Currently de-installed.
MRC / TEL / TOKYO ELECTRON Eclipse Mark IV is a sputter deposition equipment designed for processing a range of semiconductor structures and devices to exacting standards. With its improved multi-axis motion and deposition chamber technology, MRC Eclipse Mark IV offers higher product quality and increased throughput for semiconductor fabrication. TEL Eclipse Mark IV utilizes two different types of sputtering deposition. The first is Direct Current Sputtering (DCSP) which is used for sputter etching. It uses a DC power source to generate ions which bombard the substrate surface, removing and depositing material on the substrate as desired. This method is especially useful for precision etching. The second is High-Rate Unbalanced Magnetron Sputtering (HRuMS) which is used for sputter deposition. This technique utilizes a high-energy plasma generated in a vacuum chamber to ionize and deposit material on the substrate. The magnetron, an electromagnet, is used to shape and focus the plasma to achieve higher deposition rates than traditional sputter deposition techniques. Eclipse Mark IV also features advanced motion technology. The automation of motion ensures accurate delivery of substrates and materials to the chamber. The system also ensures high levels of accuracy and repeatability when placing and mounting the substrates. In addition, the unit utilizes a closed-loop control machine to precisely control the motion of the deposition chamber and ensure that all components move smoothly and accurately to exact positions. TOKYO ELECTRON Eclipse Mark IV offers a precise and flexible substrate heating tool, allowing for a temperature range of 20°-400°C. The asset is designed to provide maximum thermal uniformity and is equipped with a hot plate and a heat sink. This heating model provides a wide range of substrate sizes and shapes to be processed. MRC / TEL / TOKYO ELECTRON Eclipse Mark IV utilizes advanced vacuum control technology to maintain consistent and clean processing conditions for each job. The equipment is designed to provide a consistent atmosphere with a maximum chamber pressure of 6 Torr. In addition, the system features a CryoDiode coating to minimize unit contamination. This coating can also be monitored in-situ with an oxygen monitor. Furthermore, a pressure-balanced automatic substrate shower is included for efficient substrate processing. MRC Eclipse Mark IV from MRC provides advanced deposition, motion, heating, and vacuum control technologies to fabricate semiconductor structures and devices to exacting standards. It offers higher product quality and increased throughput as compared to traditional deposition systems and is an ideal choice for semiconductor fabrication.
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