Used ULVAC CERAUS ZI 1000 #9207442 for sale

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ID: 9207442
Wafer Size: 8"
Multi chamber sputtering system, 8" Included: (6) Chambers ICP (4) PVD LTS Degas Main body: Main CPU (6) Mini PC Monitor (4) Cold traps (4) Turbo pumps AC Rack: (4) DC Power supplies RF Generator Helium compressor Facility: Heat exchanger.
ULVAC CERAUS ZI 1000 is an advanced sputtering equipment designed for deposition of thin films for semiconductor, MEMS, and thick film applications. This system is designed for precise layer control and uniformity, and can achieve thickness accuracy down to a single nanometer. The unit is composed of a horizontal source, a grounded target, and a turbo-molecular pump for gas and vacuum control. The horizontal source consists of two independent magnetron guns and a one-piece ceramic fluoropolymer substrate that is capable of following a pre-determined deposition profile. The target is a conductive copper or aluminum plate mounted on an insulating ceramic base. The gas pressure is maintained at the sputtering chamber by the turbo-molecular pump. The sputtering process itself is a physical vapor deposition (PVD) process that involves ionizing gasses to generate a plasma in the deposition chamber. This plasma is used to cause ions in the working gas to strike the target at high velocities, releasing atoms to the substrate. By controlling the power of the sputtering source, it is possible to control the amount of material deposited and its atomic structure. ULVAC CERAUS ZI-1000 provides a number of features that make it ideal for the deposition of thin films. It has an independent shutter mechanism for each sputtering source, allowing for precise control over the deposition. It also has a pre-programmable profile for each source enabling uniform deposition over the entire substrate. It also has an advanced orientation sensing machine that enables it to automatically adjust the position of the sputtering source to ensure that the target receives the highest power density possible. In addition, the sputtering tool has a film thickness monitor, allowing precise control over the layer thickness. It also has an ionization monitoring asset that provides real-time feedback regarding the plasma formation process. Finally, the model uses advanced algorithms to ensure the deposition of uniform layers across the substrate. CERAUS ZI 1000 is an ideal choice for sputtering thin films for semiconductor, MEMS, and thick film applications. Its advanced features make it suitable for achieving precise layer control and uniformity, while its intuitive engineering interface makes it simple to use. With its accurate thickness determination and sophisticated orientation sensing equipment, this system will ensure precise and consistent results in the deposition of thin films.
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