Used ULVAC MCH-4500 #58270 for sale

ULVAC MCH-4500 is a versatile sputtering equipment that offers high-quality thin-film deposition capabilities for a variety of materials. The system includes three sputtering targets, with the option to rotate each of the targets independently. This allows the user to effectively perform co-sputtering with two different materials. The sputter power can be adjusted for each target independently, ranging from 0 - 2000W, allowing for the use of a variety of working gases. MCH-4500 also supports bias sputtering as well as continuous ion beam bombardment with a maximum ion current of 600mA. ULVAC MCH-4500 has an effective target area of 450mm x 350mm, allowing for the deposition of wafers up to a diameter of 210mm. The convenient sample loading tray makes loading and unloading the wafers quick and easy. Additionally, the use of a special shielding technique allows the chamber walls to remain cool while the interior is still maintained under a high vacuum. This method of cooling helps to prevent the deposition of unwanted films or materials on the chamber walls and can help increase process repeatability. The chamber is made of stainless steel and uses a strong baffled structure for uniform ion bombardment and/or plasma generation inside the chamber. This baffled design also helps keep the chamber clean during deposition and helps minimize films contamination from sputtered materials. Additionally, the unit is designed with a floating substrate holder which ensures wafer levelness, allowing for uniform thin-film deposition. To allow for programmable, repeatable, and reproducible film deposition, MCH-4500 comes with a touchpad-operated computer control machine. The software offers various modes of operation, including fixed sputtering current, deposited thickness, and etch rate. This makes ULVAC MCH-4500 a great choice for applications such as rapid thermal annealing, optical thin-film coatings, and advanced device fabrication. ULVAC-MCH-4500 offers a versatile and powerful sputtering tool, perfect for a range of thin-film deposition processes. Its ability to precisely rotate targets, adjust sputter power, maintain a clean chamber, and easily program parameters, make ULVAC MCH-4500 an ideal choice for those looking for powerful and repeatable thin-film deposition capabilities.