Used VARIAN 3180 #30959 for sale

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Manufacturer
VARIAN
Model
3180
ID: 30959
Wafer Size: 4"
magnetron sputtering system configured for 4" wafers, System is fully automated, cassette-to-cassette, and has high throughput, Equipped with 3 targets and an RF-sputter etch module for in-situ substrate cleaning prior to sputtering, as-is.
VARIAN 3180 sputtering equipment is an advanced, high-performance sputtering system designed to provide optimal thin film deposition capabilities. This unit uses an electron beam evaporation source, RF power source, inert gas, and a cryopumping machine. The electron beam source is used to evaporate metal and dielectric materials of a desired purity at up to 4kW of power. It has a vacuum chamber with an 8"x8"x8" working area, and a 7" diameter beam aperture. This source is capable of depositing material on substrates that are up to 8" in diameter with a pitch of up to 2". The RF power source generates up to 1000 watts of power for sputtering in 3180. The RF source is adjustable in frequency and power levels, allowing for very precise control of the sputtering process. This provides for shorter material deposition times, higher deposition rates and better throughput. VARIAN 3180 also includes an inert gas tool that is capable of providing a stable atmosphere in the working area. This includes both nitrogen and argon at pressures between 0.1 and 5 Torr. This asset is used to prevent oxidation of deposited materials by maintaining a high purity atmosphere in the chamber while sputtering. 3180 also features a cryopumping model that captures outgassing molecules and any particles produced during sputtering. This helps to ensure that deposition is of the highest possible quality, without any contaminating elements impacting the accuracy of the deposition. Overall, VARIAN 3180 is an advanced and highly capable sputtering equipment. It provides optimal thin film deposition capabilities through its range of powerful electron beam and RF sources, as well as its inert gas and cryopumping systems. This system is able to produce high-quality deposits at a high throughput rate, making it an ideal choice for a broad range of thin film applications.
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