Used VARIAN 3190 #9269838 for sale

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Manufacturer
VARIAN
Model
3190
ID: 9269838
Sputtering system, 4" Spare parts included.
VARIAN 3190 is an advanced, direct current (DC) magnetron sputtering equipment, designed for precision thin-film deposition applications in materials sciences, research and development. It has capabilities for independent or simultaneous deposition of up to four materials, as well as target-to-substrate distance control and end-point target erosion detection. 3190 holds up to four targets and employs a powerful, three-magnetron configuration to optimize film uniformity and deposition rates. Its unique modular design enables quick installation of multiple magnetrons and easy interchangeability for sputter sources. The multi-magnetron sputtering configuration is preferred in research and development environments, as it is able to compensate for source misalignment and charging effects. The proprietary Kernex™ DC power supply on the system has control capabilities for up to 700 watts, enabling precision control of both sputtering rate and bias voltage. The fully isolated target power supplies provide quiet, clean power source to all magnetrons, allowing precision control of sputtering rates. The power conditioning circuitry helps to eliminate arcing and sputtering uniformity issues caused by power spikes. The chamber geometry, together with the high-vacuum pumping unit, provides the stability and uniformity required for the most demanding substrate deposition and thin-film growth demands. Its fast chamber evacuation and pressure control is one of the most advanced in the industry. Additionally, the machine monitors and maintains a stable target-to-substrate distance during the deposition process, providing uniform thin-film deposition with minimal interference from the target erosion. VARIAN 3190 is user-friendly, with a robust open platform architecture for easy integration into existing material deposition systems. This makes the tool an ideal sputtering asset for a variety of materials science, research, and development applications. Its independent or simultaneous deposition capabilities, target-to-substrate distance control, and target erosion control make it ideal for photonic, super-lattice, and semiconductor device fabrication.
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