Used VARIAN 3280 #148076 for sale

VARIAN 3280 is a content uniformity sputtering equipment designed for high-throughput material deposition and device manufacturing. It is a single-gun unit, with a single sputter chamber, that can deposit uniform layers of metal, dielectric, and other materials such as oxides, nitrides and diamond-like compounds. It offers a maximum sputter rate of 180 Å/minute and is capable of producing high deposition rates of up to five times higher than those of other sputtering systems. 3280 is equipped with a high-end Robostage tilt-rotation manipulator that provides precise alignment and consistent film uniformity. This robotic stage allows the users to obtain uniform coverage over large areas while ensuring uniformity in patterned devices. The tilt-rotation system can provide a maximum angular range of ±25° in pitch, ±35° in roll, and 180° in yaw, allowing for highly dynamic along the Y-axis for efficient substrate rotation. VARIAN 3280 unit has a high-speed dynamic vacuum pump consisting of an N2 purging machine, a turbo pump and cryopanel cooling tool. This allows for long cycles and fast pump down, providing excellent throughput. Additionally, it features a PLC asset for improved control and accuracy of the chamber pressure and gas flow, as well as a PID feedback loop for precise temperature control with temperature uniformity settings. The model is capable of sputtering at operating pressures in the range of 10-1 to 10 mTorr and a typical sputter rate of 15-20 Å/minute. 3280 offers a wide range of sources that can be used to deposit material layers including standard target materials such as aluminum and titanium, along with materials more specific to nitrides and oxides, such as titanium nitride and aluminum dioxide. This allows users to deposit layers that are uniform in composition, morphology and thickness across the entire substrate without needing multiple maskings or shadow masks. Finally, VARIAN 3280 features an upgraded module for improved productivity, that can detect the level of sputtered material and quantity of material on the substrate, thus allowing for repeatable sputtering. In addition, the equipment has a software-based remote monitoring system and advanced parameter settings, allowing for optimization of the deposition process and improved production efficiency.