Used VARIAN 3290 STQ #9134776 for sale

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Manufacturer
VARIAN
Model
3290 STQ
ID: 9134776
Wafer Size: 6"
Sputtering system, 6" Entity target configuration: Process station #2:ALSICU Process station #3:ALSICU Process station #4:ALSICU Process station cathode configuration: Station #2:Quantum(Ratating magnet) Station #3:Quantum(Ratating magnet) Station #4:Quantum(Ratating magnet) Heater configuration: Heater type (All station): DC BIAS Heater controller(AII station): Eurotherm 808 x 3 Power supply configuration: Outer PSU station #2: AE PINNACLE 12 KW Outer PSU station #3: AE PINNACLE 12 KW Outer PSU station #4: AE PINNACLE 12 KW System vacuum configuration: Compressor: Model 8600 8R Cryo pump: Yes Water pump: No Software configuration: User's guide: ECS 3000 Version: 96.204.10U1 Floppy drive: 3.5" Double cassette loading.
VARIAN 3290 STQ sputtering equipment is a precision deposition instrument used to deposit and coat materials on substrates. It is designed to provide both high-rate and low-temperature sputtering, enabling the deposition of layer-by-layer structures with different materials on the same wafer. Through its patented Versareg™ control of the power and pressure parameters, the system provides ultimate accuracy and precision in deposition. The stainless steel chamber inside the unit is designed to accommodate multiple substrates on a flat sample holder. The chamber also features an inert backfill gas option and comes s equipped with an advanced high power 13.56 MHz RF generator for sputtering. It is also equipped with components to enable speedy sample loading and unloading. VARIAN 3290STQ also has both high-rate and low-temperature sputtering capabilities. The high-rate sputtering mode can achieve a kinetic energy of up to 34 eV, allowing the deposition of materials to occur at high rates. This also enables layer-for-layer deposition of materials with different characteristics. The low-temperature sputtering mode allows for reduced production of contaminants and low-mass sputtering. This mode enables sputtering parameters typically associated with higher performance rate such as higher target angle and self-sputtering. 3290 STQ sputtering machine is built with a sophisticated pressure feedback and vessel control technology. This technology ensures repeatability and reliable pressure and vacuum control during sputtering operations. The PFC-equipped tool also allows users to take advantage of variable pressure operation, and it enables users to maximize Ion-to-Neutral Ratio through pulse operations and variable pressure control. 3290STQ further features advanced process monitoring and control systems. These systems allow users to coordinate and manage all sputtering operations via its process monitoring capabilities. The process monitoring tools include temperature control systems, ionization implant detectors, data logging and analysis systems, and other control asset tools that allow users to monitor deposition process. Additionally, through its up-to-date advanced model software, it is able to achieve gold standard accuracy. To summarize, the performance of VARIAN 3290 STQ sputtering equipment ensures maximum accuracy and precision in loading, deposition, unloading and process control/monitoring operations. This makes VARIAN 3290STQ an ideal system for advanced sputtering operations and for the deposition and coating of materials on substrates.
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