Used VARIAN 3290 #166882 for sale

It looks like this item has already been sold. Check similar products below or contact us and our experienced team will find it for you.

VARIAN 3290
Sold
Manufacturer
VARIAN
Model
3290
ID: 166882
Wafer Size: 6"
Sputtering systems, 6" (3) Quantum targets Etch location Computer interface upgrade Includes: ECS Controller Air cooled supplies: Gen 2.5, 12 kW RF Etch Slow vent and slow pump load lock Dry pumps (8) Cryo pumps and water pump (On board).
VARIAN 3290 is a powerful sputtering equipment. Sputtering is a physical vapor deposition (PVD) process whereby material is dislodged from a target and transported to the substrate in a controlled manner. 3290 is designed for plasma-enhanced deposition up to 12.7 cm, and it can accommodate up to six sources of material. VARIAN 3290 system is controlled by a standard Windows™ interface, allowing for easy access to the unit controls, process parameters, and data logging capabilities. It features an enhanced user interface and dedicated recipe language, which allow process variables to be easily changed, monitored, and logged. The modular design allows the user to customize their machine components to suit their needs. 3290 sputtering tool is equipped with multi-gun and dynamical control capabilities, enabling the user to control multiple targets simultaneously. The dual-gun option is a unique feature to VARIAN 3290, which enables a user to have two guns with separate control parameters that can be used for responsive sputtering. The asset is supplied with a Pulsed DC™ RF Generator which offers superior ion bombardment, creating improved adhesion characteristics for the sputtered layer and enhanced rate of film deposition. In addition, the DC-Bias Option allows for uniform coverage on substrates with large step heights. 3290 is a versatile model with a wide range of possible applications. With its robust features and superior performance, VARIAN 3290 offers reliable and precise control for a wide range of sputtering processes— from vacuum metallization to precise thin-film deposition. It can be used for a variety of materials such as oxides, nitrides, and metals, and for metalizing, coating, and semiconductor device fabrication. Its precise control and fast processing times make it well-suited for industrial and research applications.
There are no reviews yet