Used VARIAN 3290 #9157043 for sale

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VARIAN 3290
Sold
Manufacturer
VARIAN
Model
3290
ID: 9157043
Wafer Size: 6"
Sputtering system, 6" P/N: 983-4353 TiW, AlCu, Hard etch CTI-Cryogenics On-Board (8) cryopumps V200-A & V200 turbo pump (2) MKS 250B controllers FLUKE 1722A Instrument controller FLUKE 8840A Multimeter Wide range thin film monitor Sputtering power supply Vacuum system controller 880RS Vacuum ionization gauge RF Matching controller Cassette motor control Temp monitor Dual CTI-Cryogenics On-Board controller Pfeiffer DCU controller MKS vacuum controller Multi-range DC sputtering power supply (2) Interlock status display (2) Deposition source control RFPP RF10S RF generator (3) CPI CPW-12/480 power supply (1) AC Power transformer/conditioner 3 Phase, 480 V, 22 A, 60 Hz.
VARIAN 3290 is a highly advanced sputtering equipment designed for the deposition of thin film coatings. Its superior performance is due to a combination of technologies including advanced etching, ion source power supplies, a four-head sputtering chamber, a rotary-claw wafer-handling mechanism, and a fully automated mass-flow process control system. It is capable of achieving repeatable uniformity on patterns with film thickness as low as 180 nanometers. 3290 uses a dual-chamber etching unit. This machine enables stable etching of metals, dielectrics, and polymers. The four-head sputtering chamber works by rotating a time-dependent programmable claw between the source and substrate. This magnetic field generates ion sputtering energy for the deposition of a uniform thin film coating. The rotary-claw wafer-handling mechanism allows for the automatic control and efficient transportation of wafers between processes. VARIAN 3290 comes with a fully automated mass-flow process control tool. This includes a graphic user interface (GUI) which allows users to control parameters like process speed, gas flow, and target material thickness. The GUI also provides a chronicle of the entire process, including start and finish times, and a detailed log of all events which occurred during the process. The sputtering asset has an impressive list of features which will allow users to achieve superior thin film coatings. This includes the deposition of dielectrics, metals, and polymers. The magnetron sputtering source has a high deposition rate, and can apply coatings with high accuracy and uniformity. It also has a large chamber capacity, capable of coating large batches of wafers. The power control of 3290 is highly accurate, and can be adjusted in 0.1 micron increments. This enables precise control over the coating thickness. In addition, the dual-chamber etching model is capable of stable and repeatable etching of various materials. Overall, VARIAN 3290 is a highly advanced sputtering equipment designed for the industry-standard uniformity of thin film coatings. Its suite of features and technologies make it one of the most technologically advanced sputter systems available on the market.
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